We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers August 20, 2008 Case Study & Application Note Measure solder bump coplanarity Does your Bumping Process Maintain the Same Plane? Ensuring the height and coplanarity of conductive bumps improves yields. Learn more... Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   NAND prices will drop 60% for the year Weaker-than-expected demand and falling prices mean the NAND flash memory market won't grow in 2008. The average price of memory will ... Purchasing Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Industry News   Ericsson, STMicro form semiconductor joint venture Ericsson and STMicroelectronics have formed a joint venture to sell semiconductors and platforms to mobile manufacturers. The deal ... ZDNet Micron Bucks Weak NAND Market Conditions, Closes Gap with Hynix in Q2 Micron Technology Inc. in the second quarter narrowed its NAND flash memory market-share gap with Hynix Semiconductor Inc., setting the ... iSuppli Corporation BTU Lands Order for Thin Film Solar Equipment BTU International has landed an order, exceeding $2 million in value, from a major thin film solar customer. As per the agreement, the ... Green TMCnet Micron memory card partners settled Micron Technology has made further progress on its memory card deployment by settling controller IC and backend production partners ... DigiTimes Infineon's Bauer calls for innovation, cost control In a maturing semiconductor industry, double-digit growth rates are a thing of the past. And strict cost management is essential to survive ... EETimes Fab-tool ratio hits parity despite lull Japan's fab-tool book-to-bill ratio has finally reached parity, but the market for all semiconductor equipment vendors remains slow. ... EETimes SRC urges lawmakers to prioritize government, industry collaboration to boost American competitiveness With the aim of improving the return on investment in federal research and to increase the pool of future scientists and engineers, the ... EDN TI unveils industry’s thinnest 500-mA power converter solution Tiny 6-MHz step-down DC/DC converter supports ultra-thin, feature-rich smart phones, wireless modules and portable electronics. Giving ... WebWire Keep the customer satisfied — no matter how small Real competition may only just be hotting up, but New Zealand already has a few next generation telcos. Computerworld looked at four companies: ... Computerworld U.S. calls for panel to probe EU high-tech tariffs Trade representative says EU is charging duties on equipment that should be tariff-free under a 1997 agreement. A U.S. trade representative has ... Purchasing Micron Narrows Gap in Flash Market Share, Says iSuppli Fourth-place NAND flash memory chip maker Micron Technology (MU) narrowed the gap with South Korea's third-place Hynix Semiconductor in ... Barron's Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Technology News   Electric fields stir films on small scales By applying an electric field in the plane of a water based film – and applying a voltage from electrodes in the perpendicular direction – ... Eureka Netcrystal Stretches the Limits of Solar Performance and YHN’s Credulity Netcrystal has developed a MEMS-style solar technology that lets photovoltaic silicon stretch and expand to cover large areas. ... Greentech Media Researchers Apply Self-Assembly to NIL Master for Bit-Patterned Media A method that combines electron-beam (e-beam) patterning with a self-assembling block copolymer could prove critical to reducing the cost ... Semiconductor International German researchers accelerate MRAM technology A research team at the German metrology institute PTB has carried out a switching process in a magnetic medium at the highest speed theoretically ... EETimes Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Corporate News Submit Challenges and Opportunities Face the DTV Chip and Display Driver Markets Digital Television (DTV) semiconductor and display driver suppliers will face significant challenges in the coming months and years as the ... iSuppli Corporation IWLPC Moving Toward Largest Program in Its History This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken ... SMTA RPMC Lasers Introduction RPMC Lasers would like to introduce ourselves as the North and South America distributor for high-power diode lasers made by Jenoptik. We ... RPMC Lasers Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Better Reflectivity Control with ShinEtsu GBARC ShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more… ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. 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