We search for industry news, so you don't need to.
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Die Bonding Made Easy
Precision X-Form Needles
 The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
Apple faces growing list of problems with iPhone
While Apple Inc.'s 3G iPhone has been a hot seller, a rash of service problems and technical glitches has left the company with a black eye ...
Market Watch
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Chip R&D spending grows in first quarter
Worldwide spending on semiconductor research and development grew 12% in the first quarter of 2008 compared to the first quarter of 2007, according ...
Purchasing
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Two Large Solar Plants Planned in California
Companies will build two solar power plants in California that together will put out more than 12 times as much electricity as the largest ...
The New York Times
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Manufacturing could hit a new upswing in the United States
A few years ago, it was still a subject of regular outrage. Jobs were headed to Mexico. Factories moving to China. Everybody hated globalization ...
Venture Beat
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Rumor mill: Seagate to buy SanDisk?
The rumors were flying at the Flash Memory Summit here. The big rumor is that Seagate Technology Inc. is interested in buying all or part of ...
EETimes
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SanDisk CEO tips rewriteable 3-D memory
At the Flash Memory Summit, SanDisk Corp.'s top executive provided more details about its efforts to devise a rewriteable 3-D memory device--a ...
EETimes
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Infineon licenses technology for tamper-proof chips
Infineon Technologies AG has agreed to license security technology for tamper-resistant semiconductors from Cryptography Research Inc. ...
EETimes
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Building microchips from the bottom up
Using a novel system based on molecules that can assemble themselves into precise patterns, MIT researchers have come up with a way of beating ...
MIT News
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BeSang, NNFC, Stanford NanoFab Develop "Breakthrough" 3D IC Technology
National NanoFab Center in Korea, Stanford NanoFab (SNF), and BeSang Inc claim to have developed a breakthrough 3D IC technology which enables ...
Tech-on
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Neo Solar Power to start producing thin-film solar cells in 2009
Neo Solar Power held the opening ceremony for its new crystalline solar cell fab in Hsinchu, Taiwan, on August 13. Operation will be started ...
DigiTimes
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North America Semiconductor Equipment Leading Indicator up in June
Economic research firm e-forecasting.com today announced that the North American Semiconductor Equipment Sales leading indicator increased in ...
Controlled Environments
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Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
 Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
Drawing Circuits with 11 Million Nano Pens
The demand for ever faster, cheaper electronics is pushing the lithography-based manufacturing techniques standard in the ...
MIT Technology Review
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More-Efficient Solar Cells
By changing the way that conventional silicon solar panels are made, Day4 Energy, a startup based in Burnaby, British Columbia, has found a way ...
MIT Technology Review
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Super Talent Shrinks Thumb Drives to 1.4"
The new Pico D is the smallest drive in Suoer Talent's already micro-sized line at just 1.4" long, thanks to chip-on-board technology ...
Digital Trends
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Using the Earth's Atmosphere for High-Performance Night Vision
They can be seen on buildings and toll booths, hidden within streetlight enclosures on traffic light poles and even on the Statue of Liberty ...
Advanced Imaging Magazine
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Leaked Intel slides show 8-core CPUs, AVX
Intel's upcoming processor generations will double the number of cores per chip and add a brand new language for specialized code, according ...
electronista
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Patterning next-generation circuitry with ordered polymers
For decades, the microelectronics industry has relied on optical lithography to pattern the increasingly minute features of electronic ...
ars technica
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Pseudo-Capacitors replacing battery solution
By introducing the product family PSHLR CapComp GmbH is now offering new Pseudo Capacitor devices manufactured by NESSCAP Ltd. Korea ...
Open PR
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Red-E-Set Universal Boards Supports
ROI CALCULATOR
 Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more…
Production Solutions, Inc.
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Today's Sponsor
ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
 For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu
Solar wafer coating - White paper
USI has developed Nozzle-less
 Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more…
Ultrasonic Systems, Inc.
Checking for Brittle Fracture Failures?
Replace drop testing with high strain rate bondtesting
 Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more…
Dage Precision Industries
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