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Solve your Counterfeit Component Problem
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Dage Precision Industries CTThis paper examines recommended techniques for identifying counterfeit components within the supply chain, and describes methodologies that minimize the risk of using these devices on production circuit boards in the assembly process. Learn more…
Dage Precision Industries




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  Industry and Technology News Index
August 15, 2008  -  Click the title to read the full article.

BeSang, NNFC, Stanford NanoFab Develop "Breakthrough" 3D IC Technology
National NanoFab Center in Korea, Stanford NanoFab (SNF), and BeSang Inc claim to have developed a breakthrough 3D IC technology which enables ...
Tech-on
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December 31, 2008 - Industry News
Soitec Establishes SOI Wafer Fab in Singapore
France-based semiconductor manufacturer Soitec set up a new wafer fab in Singapore in November 2008, aiming at better serving its customers ...
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December 31, 2008 - Technology News
Techniques for Integrating Components Take Off
The idea of embedding discrete passive components on a printed circuit board (PCB) or substrate is not new. Techniques that eliminate ...
Tech-On English
December 29, 2008 - Industry News
Oversupply of Photovoltaic Modules Weakens Solar Market, Says iSuppli
Bringing an end to eight consecutive years of growth, global revenue for photovoltaic (PV) panels is expected to fall nearly 20% in 2009, as a ...
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December 24, 2008 - Top Story News
Semiconductor Capital Equipment Spending to Decline 32% in 2009, Says Gartner
An economic recession of unknown proportion, combined with supply-side issues, has semiconductor manufacturers shifting into panic mode for ...
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December 10, 2008 - Technology News
Metal-metal Bonding on the Rise, SUSS MicroTec Says
SUSS MicroTec AG of Germany delivered a lecture on bonding technologies under the title "Packaging - wafer level vs packaging level - which ...
Tech-On
December 2, 2008 - Technology News
MEMS Display Manufactured by Roll-to-roll Printing
The Institute of Industrial Science (IIS) of the University of Tokyo developed a MEMS display by using roll-to-roll printing technology ...
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December 1, 2008 - Industry News
LCD TV Shipments Continue to Grow Despite Reduced Forecast
In light of the current economic and financial crises, iSuppli Corp has trimmed its forecast for LCD TV shipments, but still anticipates ...
Tech-On
November 21, 2008 - Technology News
Actel Leverages UMC Foundry Solutions for 65nm eFlash FPGAs
Actel Corp and UMC are cooperating in the production of Actel's next-generation Flash-based field programmable gate arrays (FPGA). ...
Tech-On English
November 18, 2008 - Industry News
Sellers Market for PV Raw Materials to Shift in Buyers Favor in 2009, Says iSuppli
Pricing for polysilicon used to create photovoltaic (PV) cells is expected to drop starting from 2009 due to fundamental imbalances in ...
Tech-On
October 31, 2008 - Industry News
China's SMIC on Its New MEMS Foundry Business
Semiconductor Manufacturing International Corp of China launched a MEMS foundry service. Nikkei Microdevices interviewed Herb Huang, Director ...
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October 15, 2008 - Industry News
Semiconductor Industry Revenue Down Slightly in Q2 2008, Says EDA Consortium
The EDA Consortium (EDAC) Market Statistics Service (MSS) has announced that the electronic design automation (EDA) industry revenue for Q2 ...
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September 26, 2008 - Technology News
Silicon Engineered Substrates Benefit RF, Opto, Solar Cells
Recent advances in silicon engineered substrate materials promise to reduce chip voltage and power consumption, boost performance in tricky ...
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September 24, 2008 - Industry News
Toshiba Cuts Forecast as Semicon Biz Slumps
Toshiba Corp lowered its earnings forecasts for fiscal 2008. An operating loss of ¥30 billion (approx US$282 million) will be logged in the ...
Tech-On
September 2, 2008 - Industry News
Hynix Completes Construction of 300mm Fabrication Plant in Cheongju
Hynix Semiconductor Inc has completed construction of its third factory in Cheongju, Korea. The two-storey factory has 300mm wafer fabrication ...
Tech-On
August 19, 2008 - Industry News
27% Annual Growth Seen for Global Solar Cell Market
The global solar cell market will grow at an annual rate of 27% on average until 2012 to approx US$42.5 billion, 3.9 times larger than ...
Tech-On
August 15, 2008 - Industry News
BeSang, NNFC, Stanford NanoFab Develop "Breakthrough" 3D IC Technology
National NanoFab Center in Korea, Stanford NanoFab (SNF), and BeSang Inc claim to have developed a breakthrough 3D IC technology which enables ...
Tech-on
August 6, 2008 - Industry News
Sony to Spend 40 Bil Yen to Boost Li-ion Battery Production in Japan
Sony Corp has announced that it will spend about ¥40 billion (approx US$370 million) to enhance its Li-ion secondary battery production. ...
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July 28, 2008 - Industry News
How Does National Semiconductor Boost Solar Power System Efficiency?
National Semiconductor Corp of the US developed the "SolarMagic," a technology to boost the performance of solar power systems, and ...
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June 17, 2008 - Industry News
Semiconductor Sales at Record Levels Despite Slower Growth, Says SIA
Healthy demand from key end-markets will keep worldwide semiconductor sales at record levels through 2011, said Semiconductor Industry ...
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June 5, 2008 - Industry News
Sharp, Canon, Sanyo Take Top 3 Spots in Photovoltaic Technology Ranking
A consulting firm evaluated the technological competitiveness of Japanese companies involved in photovoltaic business and ranked Sharp ...
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June 4, 2008 - Technology News
Toshiba Presents Semiconductor Industry's Efforts to Go Green
"We consider environmental activities as one of the most significant challenges that the Japanese semiconductor industry is facing," said ...
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June 4, 2008 - Technology News
Toshiba Packages MEMS Devices in Front-end Process
Toshiba Corp unveiled two packaging technologies that encapsulate MEMS devices collectively at the wafer level through front-end processing ...
Tech-On
June 3, 2008 - Technology News
Toshiba Presents Semiconductor Industry's Efforts to Go Green
"We consider environmental activities as one of the most significant challenges that the Japanese semiconductor industry is facing," said ...
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June 3, 2008 - Technology News
Toshiba Packages MEMS Devices in Front-end Process
Toshiba Corp unveiled two packaging technologies that encapsulate MEMS devices collectively at the wafer level through front-end processing ...
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April 23, 2008 - Technology News
Hitachi Metals Develops 'World's Smallest' Triaxial Acceleration Sensor
Hitachi Metals Ltd developed a new triaxial acceleration sensor, which the company claims is the world's smallest. It is a piezoresistive ...
Tech-On
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Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
Celebrating 40 yearsHeraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials…
Heraeus, Inc.




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