We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers August 5, 2008 Case Study & Application Note Measure transparent materials Control the height and volume of your clear flux, epoxy or adhesive deposits with sub-micron precision. Learn more... Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   Strong PC demand boosts chip sales, DRAM & Flash prices plunge PC sales appear to be much stronger than expected earlier this year, as semiconductor sales showed a solid performance in the first half of ... TG Daily Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Industry News   Worldwide Chip Sales Up 5.4% in First Half of 2008 Global sales of semiconductors for the first half of 2008 grew to $127.5 billion, an increase of 5.4 percent over the first half of 2007 when ... Semiconductor Industry Assoication Automotive semi content to grow constantly, Semicast says Despite the recent dent in automotive OEM's market expectations, the semiconductor content of light road vehicles will continue to grow ... EETimes How Cloud Computing Is Changing the World A major shift in the way companies obtain software and computing capacity is under way as more companies tap into Web-based applications. At first ... Business Week Test Socket Industry Faces Issues Scaling Below 0.4 mm Pitch The test socket industry is encountering both electrical and mechanical issues as package pitch sizes shrink below 0.4 mm. The major ... Semiconductor International iSuppli sees DRAM chip prices down 10 pct by end-Q3 Global prices for DRAM memory chips, used mainly in personal computers, are expected to fall 10 percent from current levels by the end of the ... Reuters Printed Electronics Materials to Surpass $11 billion According to a new report from NanoMarkets, a leading industry analyst firm based here, the market for electronic inks and related substrate ... Street Insider Automotive semi content to grow constantly, Semicast says Despite the recent dent in automotive OEM's market expectations, the semiconductor content of light road vehicles will continue to grow. ... EETimes Torch is passed to MEMS Microelectromechanical system (MEMS) chips have been built into the Olympic Torch--not the one that traveled around the world, but the ... EETimes Nvidia says it is not quitting the chipset market Nvidia has released an official statement refuting the recent Digitimes story claiming that the company is planning to quit its chipset ... DigiTimes Industry Veterans Form Solar Group Marc Chason; James J. Hickman, Ph.D.; and Gene H. Weiner formed Quantum Solar Group LLC (QSG) to help members of the PWB, SMT, and electronic ... SMT Magazine Digging a hole in China If there was ever a standard that should never have come to be, it's time-division, synchronous code-division multiple access (TD-SCDMA). Yet, ... EETimes Semiconductor sales increase in first half of 2008 Global sales of semiconductors for the first half of 2008 grew to $127.5 billion, an increase of 5.4% over the first half of 2007, according ... Purchasing Emerging markets fuel rise in chip sales Developing economies in China, India, Europe and Latin America fueled a 5.4 per cent rise in global chip sales in the first half of 2008, ... Monsters and Critics Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Technology News   Speaking of Science: Nanodevices could have big future in power generation The field of nanomanufacturing is an area where a tremendous amount of research is occurring worldwide across a broad spectrum of ... Grand Junction Sentinel The Grill: Peter Sandborn talks about living with obsolescence An obsolescence expert talks about anticipating obsolescence, dealing with it and understanding that it is part of Microsoft's business plan ... Computerworld Solar-cell simulation gets a dino-sized push from Synopsys' Sentaurus Although its name conjurs connections with the dinosaur realm, fallen Roman (or Romulan) Empire heroes, or fabled half-human/half-horse ... Fabtech Microscopic ink helps reveal fakes A nanotechnology company wants to help fight counterfeit pharmaceuticals by printing codes on each pill. A small Skokie, Ill.-based technology ... Oregon Live World's highest highest-resolution holograms debut An international team of researchers combined an X-ray laser and a lens-less pinhole camera to demonstrate the world's smallest and highest- ... EETimes Surgical micro-robots in four years Italian scientists are four years away from creating micro-robots that can carry out complicated stomach surgery without the need for doctors ... Ansa Business News ASICs: eASIC delivers 45nm Structured ASIC with zero mask charges New Nextreme-2 family of Structured ASICs from eASIC aimed at reversing decline of worldwide ASIC design starts. The last few years have seen ... Embedded Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture faliures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more… Dage Precision Industries Corporate News Submit Sunny Prospects for the Solar Cell Manufacturing Equipment Market Escalating global population, changing lifestyles, and rapid industrialization has created a huge disparity in demand and supply of ... Frost & Sullivan Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more… MEPTEC Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. 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