We search for industry news, so you don't need to.   Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI   Industry and Technology News Index August 1, 2008  -  Click the title to read the full article. ASAT Holdings Announces Financial Results for the Fourth Quarter and Fiscal Year 2008 ASAT Holdings Limited announced financial results for the fourth quarter and fiscal 2008, ended April 30, 2008. Net revenue for the 4th quarter ... Semiconductor International We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Semiconductor International January 8, 2009 - Industry News Wafer-Level Packaging Trends Up in 2009 Wafer-level packaging trends include increasing demand, higher I/O, finer pitch, increased power for automotive applications, and high-accuracy ... Semiconductor International December 30, 2008 - Industry News Japan’s 3-D R&D Consortium Takes Shape The manager of Japan’s government-backed 3-D IC technology development project outlined the project’s goals, and companies ranging from ... Semiconductor International December 24, 2008 - Industry News Flash Vendors Facing Scaling Challenges With flash memory scaling coming under increasingly sharp questioning, Toshiba Corp. (Tokyo) researchers said they have developed a double ... Semiconductor International December 24, 2008 - Technology News Ulvac Enables Flexible Li-Ion Battery Ulvac Inc. has developed a manufacturing process flow for very thin (50 ìm) lithium-ion rechargeable batteries, using semiconductor process ... Semiconductor International December 19, 2008 - Industry News Leading-Edge Logic Processes Presented at IEDM Session An all-star cast of companies presented leading-edge processes yesterday at a session on advanced CMOS logic at the International Electron ... Semiconductor International December 18, 2008 - Industry News STATS ChipPAC to Lay Off 1600 in Latest Restructuring Stats ChipPAC Ltd. (Singapore), which provides semiconductor test and advanced packaging services, has responded to the global semiconductor ... Semiconductor International December 18, 2008 - Industry News IEDM Panel: Processing Costs Headed Up With more expensive tools and new process modules coming, IC manufacturers will struggle to maintain the cost-per-function ... Semiconductor International December 11, 2008 - Technology News Intel to Describe 32 nm Logic Process, New 45 nm SoC Platform, at 2008 IEDM Intel Corp. (Santa Clara, Calif.) will go to next week’s International Electron Devices Meeting (IEDM) with a late paper that divulges some ... Semiconductor International December 11, 2008 - Industry News Applied Announces TSV Etcher, In-Fab Mask Inspection Capability In twin announcements, Applied Materials Inc. announced an etch system aimed at through-silicon via (TSV) applications. Also, Applied said it ... Semiconductor International December 9, 2008 - Technology News Japan’s 3-D R&D Consortium Takes Shape At SEMICON Japan, managers of the government-backed 3-D IC technology development project outlined the project's goals. Also at the show, ... Semiconductor International December 9, 2008 - Industry News Japan’s 3-D R&D Consortium Takes Shape The manager of Japan’s government-backed 3-D IC technology development project outlined the project’s goals, and companies ranging from ... Semiconductor International December 2, 2008 - Technology News Applied Announces TSV Etcher, In-Fab Mask Inspection Capability In twin announcements today, Applied Materials Inc.announced an etch system aimed at through-silicon via (TSV) applications. Also, Applied ... Semiconductor International November 24, 2008 - Technology News ST joins MIT, ultra-low-power MCU devices group STMicroelectronics announced it has joined the Microsystems Industrial Group (MIG) industry consortium at the Microsystems Technology Labs ... Semiconductor International November 21, 2008 - Industry News SIA Forecast: 2009 Down Almost 6% Although visibility is limited by current questions about consumer confidence, the Semiconductor Industry Association announced its ... Semiconductor International November 21, 2008 - Top Story News Industry Downturn No. 11 Won't Be as Bad as No. 10 Just as people can't help but compare the current global economic recession to the Great Depression, reviewing the semiconductor ... Semiconductor International November 20, 2008 - Industry News 3-D, TSV Need Standards and Thermal Solutions to Advance Tuesday sessions at the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., indicate ... Semiconductor International November 19, 2008 - Top Story News 3-D Integration Lacking in Design and Test Support At a symposium leading up to the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., ... Semiconductor International November 18, 2008 - Technology News 3-D Integration Development Threatened by Economic Uncertainty As presenters and attendees prepare for the opening of this year's 3-D Architectures for Semiconductor Integration and Packaging conference, ... Semiconductor International November 14, 2008 - Industry News Silicon Wafer Shipments Contract in Third Quarter 2008 Worldwide silicon wafer area shipments contracted almost three percent during the third quarter of 2008 when compared to the second quarter ... Semiconductor International November 12, 2008 - Technology News Touch Panel Displays Gain Reliability Touch panel displays with improved reliability and endurance emerged at the FPD International 2008 show, held recently in Yokohama, Japan ... Semiconductor International November 11, 2008 - Industry News IBM Offers 45 nm SOI Foundry Offering IBM Corp. said it is offering a 45 nm silicon on insulator (SOI) technology to foundry customers, including SOI-aware standard cell libraries from ... Semiconductor International November 7, 2008 - Industry News China’s Chip Industry Facing Challenges China's semiconductor industry has reached a plateau, with local design houses finding it hard to reach the critical mass enjoyed by U.S. ... Semiconductor International November 6, 2008 - Industry News IC Industry Entering ‘Capitulation Mode’ The semiconductor industry is cutting back investments, engaging in what Bill McClean, president of IC Insights, called "capitulation mode," ... Semiconductor International November 5, 2008 - Technology News TMV: An ‘Enabling’ Technology for Next-Gen PoP Requirements Demand for package-on-package (PoP) is still rising, thanks in large part to wildly popular smartphones like Apple’s (Cupertino, Calif.) iPhone ... Semiconductor International November 4, 2008 - Industry News MEMC Electronic chief has resigned Nabeel Gareeb, President and CEO for 6 years was the area's highest-paid executive in 2007. MEMC announces board member Marshall will be ... Semiconductor International To find more articles from Semiconductor International, use the search form below. MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more… MEPTEC Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.