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Bringing the Best Together Ablestik and Emerson & Cuming join Henkel
Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more
Henkel Corporation
ST selling 8-inch Phoenix fab to Chartered?
Last year at about this time STMicroelectronics disclosed that it would close three of its manufacturing operations over the next two to three ...
EDN
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Should a CEOs health be secret?
Steve Jobs’ health came under scrutiny recently after the Apple chief executive’s gaunt appearance at the company’s developer conference ...
Financial Times
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IPC Survey - Industry Not Prepared for REACH
Like a bolt of lightning, the results of IPC's recent survey on REACH Preparedness in the North American and European Interconnect Industry ...
IPC
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Vertical Circuits and Aptos Technology Sign Strategic Manufacturing Agreement
Vertical Circuits, Inc. announced the signing of a strategic manufacturing agreement with Aptos Technology, a major Taiwan based ...
Market Watch
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Local designers drive Chinese IC market growth
Sales of semiconductor chips designed in China are surging at a double-digit clip helping to offset slower growth in the country's previously ...
EETimes
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KLA buys Vistec's inspection unit
Continuing on its acquisition spree, KLA-Tencor Corp. has entered into an agreement to acquire the inspection business unit of Vistec ...
EETimes
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Return of glory days for semiconductor industry
It was an excellent May for the semiconductor market, reports Future Horizons, Europe's leading semiconductor market analyst company. ...
Electronics Weekly
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Economists, mathematics, and where the semiconductor industry is headed this year
A snide person might observe that if circuit designers were equipped with the same formidable mathematical skills as economists, we would all be ...
EDN
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Oki transfers 95% of semiconductor business to Rohm
Further shaking up Japan's chip industry, Kyoto-based Rohm Co Ltd will take control of Tokyo-based Oki Electric Industry Co Ltd's semiconductor...
EDN
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Garmin delays nuvifone, cuts outlook; shares slump
Garmin Ltd. shares took a beating, falling almost 22% after the maker of GPS navigational devices delivered mixed second-quarter financial ...
Market Watch
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Mobile Phones to Propel Demand for Low-Cost Micro-Electro-Mechanical Systems
Research and Markets has announced the addition of Frost & Sullivan's new report "World Markets for MEMS in Mobile Phones" to their offering. ...
Market Watch
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mBGA Flux deposition with ultrasonic coating technology
USI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting
Detecting brittle fracture faliures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more
Dage Precision Industries
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Today's Sponsor
YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface
YESTech's advanced Thin Camera and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more
YESTech
ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding
For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu
MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics
Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more
MEPTEC
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