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July 31, 2008


Case Study & Application Note
Measure transparent materials
Transparent MaterialsControl the height and volume of your clear flux, epoxy or adhesive deposits with sub-micron precision. Learn more...
Cyber Technologies

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Semicon Korea: The largest exposition
dedicated to semiconductor and FPD manufacturing
Semicon KoreaJoin Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more…
SEMI
Letters Submit
Counterfeit Components: UKEA Launch Their Position
How can Cisco get involved with UKEA and participate as we agree with all the comments in this article?
Kamran Mohajer
Cisco

Semiconductor Packaging News
Advertising delivers!
Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News
Top Story  
Package-on-package is killer app for handsets
To continue Moore's Law trend toward smaller, sleeker handset devices, designers can leverage advanced packaging and interconnect methods to ...
EETimes

Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
Industry News  
ST selling 8-inch Phoenix fab to Chartered?
Last year at about this time STMicroelectronics disclosed that it would close three of its manufacturing operations over the next two to three ...
EDN
Should a CEOs health be secret?
Steve Jobs’ health came under scrutiny recently after the Apple chief executive’s gaunt appearance at the company’s developer conference ...
Financial Times
IPC Survey - Industry Not Prepared for REACH
Like a bolt of lightning, the results of IPC's recent survey on REACH Preparedness in the North American and European Interconnect Industry ...
IPC
Vertical Circuits and Aptos Technology Sign Strategic Manufacturing Agreement
Vertical Circuits, Inc. announced the signing of a strategic manufacturing agreement with Aptos Technology, a major Taiwan based ...
Market Watch
Local designers drive Chinese IC market growth
Sales of semiconductor chips designed in China are surging at a double-digit clip helping to offset slower growth in the country's previously ...
EETimes
KLA buys Vistec's inspection unit
Continuing on its acquisition spree, KLA-Tencor Corp. has entered into an agreement to acquire the inspection business unit of Vistec ...
EETimes
Return of glory days for semiconductor industry
It was an excellent May for the semiconductor market, reports Future Horizons, Europe's leading semiconductor market analyst company. ...
Electronics Weekly
Economists, mathematics, and where the semiconductor industry is headed this year
A snide person might observe that if circuit designers were equipped with the same formidable mathematical skills as economists, we would all be ...
EDN
Oki transfers 95% of semiconductor business to Rohm
Further shaking up Japan's chip industry, Kyoto-based Rohm Co Ltd will take control of Tokyo-based Oki Electric Industry Co Ltd's semiconductor...
EDN
Garmin delays nuvifone, cuts outlook; shares slump
Garmin Ltd. shares took a beating, falling almost 22% after the maker of GPS navigational devices delivered mixed second-quarter financial ...
Market Watch
Mobile Phones to Propel Demand for Low-Cost Micro-Electro-Mechanical Systems
Research and Markets has announced the addition of Frost & Sullivan's new report "World Markets for MEMS in Mobile Phones" to their offering. ...
Market Watch

mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
Technology News  
State of embedded
VITA, the governing body of the VMEbus standard, has just released an addendum to its annual State of the Industry. It's authored by Ray ...
Embedded
HP’s $40 20b Business Calculator based on standard 32-bit Atmel Microcontroller
Time was, back in the early 1970s, calculator chips were the ultimate proof of semiconductor manufacturing prowess. Many 4-banger (add, ...
EDN

Checking for Brittle Fracture Failures?
Replace drop testing with high strain rate bondtesting
Dage Precision Industries BTDetecting brittle fracture faliures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more…
Dage Precision Industries

Corporate News Submit
Lord Corp. Develops Thermally-Conductive Flip Chip Underfill Technology
LORD Corporation has developed a thermally conductive flip chip underfill that offers an improved thermal path for heat reduction. Even though a ...
Lord Corporation
Designed in China: Domestically Conceived Chip Market Booms in Nation
Although China’s semiconductor purchasing boom is cooling down, the nation’s demand for locally designed chips is heating up, with ...
iSuppli Corporation
The Next Revolution for Semiconductor Packaging & Circuit Assembly Industries
The Semiconductor manufacturing industry is today facing more than ever the challenge to explore the so-called More-than-Moore 3-D integration ...
Electroncis.ca
Agilents' Array Structure Parametric Test Solution Wins Best Product Award from Semiconductor International
Agilent Technologies Inc. announced that its N9201A Array Structure Parametric Test Solution won the Semiconductor International 2008 ...
Agilent Technologies
Today's Sponsor

YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech

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ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
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MEPTEC Presents Semiconductor Packaging
Impacting the Age of Consumer Electronics
Medical Electronics SymposiumJoin MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more…
MEPTEC


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