We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 25, 2008 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   Infineon presents mixed results In the third quarter of its FY 2008, chip maker Infineon continued to suffer from adverse currency effects and a general market slump. Sales ... EETimes Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   Samsung dives as consumer spending slows Shares in Samsung, Asia's biggest electronics maker, fell at their sharpest daily rate in four years today amid concerns that the economic ... Times Online Amkor Worth a Look Amkor Technology (AMKR) provides semiconductor packaging and test services. Its products range from the traditional, "off-the-shelf" ... Seeking Alpha 3D-stacking IC consortium established in Taiwan Driven by growing demand for strong IC design integration, Taiwan's Industrial Technology Research Institute (ITRI) recently established ... DigiTimes Intel Welcomes Home Integrated Chips Intel's plans to bring system-on-a-chip (SOC) devices to market have come to fruition, with the company introducing its first eight ... PC Magazine Shrink mobile devices with MEMS Out-of-the-box thinking is clearly needed if mobile phone design is to enable the ubiquitous services that future subscribers are going to ... Embedded APM and UMC partner for MEMS wafer fab Asia Pacific Microsystems Inc. (APM) has reached an alliance agreement with semiconductor foundry UMC for 8-inch MEMS wafer fab capacity. ... Small Times MEMC Electronic Materials shares hit new low Shares of MEMC Electronic Materials Inc. sank to a new low Thursday, after the silicon wafer maker's second-quarter results missed Wall ... Forbes Cabot Microelectronics reports flat Q3 earnings Cabot Microelectronics Corp. reported third-quarter earnings that remained flat over the prior-year quarter, despite an increase in ... RTT News First Solar to Build 10 MW Solar PV Power Plant for Sempra Generation First Solar, Inc. announced that it will build a 10 megawatt (MW) photovoltaic (PV) power plant for Sempra Generation near Boulder City ... RedOrbit Lattice Semiconductor Reports Second Quarter Financial Results Lattice Semiconductor Corporation announced financial results for the second quarter of fiscal 2008 ended June 28, 2008. For the second ... CNN Money Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Technology News   Intel rolls out new embedded line-up Intel has formally introduced its new line of embedded processors at a press conference in San Francisco. Gadi Singer, mobility group ... What PC? Intel: Human, computer intelligence will merge in 40 years At Intel Corp., just passing its 40th anniversary and with a myriad of chips in its historical roster, a top company exec looks 40 years ... IDG Material may help autos turn heat into electricity Researchers have invented a new material that will make cars even more efficient, by converting heat wasted through engine exhaust into ... PhysOrg Photonic chip chases terabit processing Researchers have demonstrated error-free demultiplexing of a 640 Gbit/s optical signal using a planar waveguide made from chalcogenide glass ... Fibre Systems Microcontroller detects pulses While recently designing an automatic test station employing a microcontroller, I faced a nonstandard task: Detect the presence or ... EDN The secret, nonspectral lives of analog-input filters Analog-filter designs manage an uncommonly large number of core parameters compared with designs of other analog-circuit-block types. ... EDN Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit Agilent Releases a Comprehensive RF and Microwave Switch Selection Guide Agilent's new "RF and Microwave Switch Selection Guide" provides comprehensive information on Agilent's entire portfolio of switches ... Agilent Technologies Applied Materials New eHARP System Extends Production-Proven STI Gap-Fill Technology to 32nm and Beyond Applied Materials, Inc. announced its Applied Producer® eHARP™ system, extending the production-proven HARP SACVD®1 gap-fill technology for ... Applied Materials BTU's Pyramax 100 Reflow Oven Wins 2008 Advanced Packaging Award BTU International, Inc. was presented with an Advanced Packaging Award in the Reflow Equipment category for its Pyramax 100 reflow oven. The ... BTU MIRTEC Receives Advanced Packaging Award for MV-7L In-Line AOI Machine MIRTEC announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the ... MIRTEC Latest VectorGuard® Technology from DEK Earns Advanced Packaging Award When DEK's revolutionary VectorGuard® stencil technology was introduced six years ago, the company pledged ongoing engineering investments to ... DEK STATS ChipPAC Wins 2008 Advanced Packaging Award for New Flip Chip Package Integration Technology STATS ChipPAC Ltd. announced it has won the 2008 Advanced Packaging Award in the 3D Packaging Technology category for its Flip Chip Package-In ... STATS ChipPAC Kyzen’s AQUANOX A4241 Wins Two 2008 Advanced Packaging Awards Kyzen announces that its AQUANOX® A4241 PCB and Stencil Cleaner won an Advanced Packaging Award in the category of Cleaning Chemistries and ... Kyzen Corporation Aqueous Technologies Trident Automatic Defluxing System Wins Two 2008 Advanced Packaging Awards Aqueous Technologies Corp. announces that Trident, its fourth-generation automatic defluxing system, was awarded two Advanced Packaging Awards ... Aqueous Technologies Fine Line Stencil Wins a 2008 Advanced Packaging Award Fine Line Stencil announces that it has been awarded an Advanced Packaging Award in the category of Handling Equipment/Fixtures for its ... Fine Line Stencil Today's Sponsor Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu mBGA Flux deposition with ultrasonic coating technology USI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more... Ultrasonic Systems, Inc. Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.