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  Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
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Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
Celebrating 40 yearsHeraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials…
Heraeus, Inc.




NEW Hesse & Knipps BONDJET BJ915L
for your leadframe applications
Bond Jet BJ920Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more…
Hesse & Knipps
  Corporate News Index
July 25, 2008

Agilent Releases a Comprehensive RF and Microwave Switch Selection Guide

Agilent's new "RF and Microwave Switch Selection Guide" provides comprehensive information on Agilent's entire portfolio of switches, which is comprised of both electromechanical and solid state switches. Packed with information, this guide provides you with all the technical information you need to select the right switch for your application.

The switch selection guide provides an overview of electromechanical and solid state switches and switch drivers. Characteristic switch parameters such as switching speed, isolation, and insertion loss including typical applications and configuration are provided Easy-to-use selection and option tables provide detailed specifications and options on Agilent's entire portfolio. Switch driver recommendation, based on application need, can also be found in this document.

Contact:
Agilent Technologies

Janet Smith
http://www.agilent.com/

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Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology




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