We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 24, 2008 Case Study & Application Note How flat are your substrates? Packaging coplanarity issues begin with the flatness of your substrates. Learn more… Cyber Technologies Semicon Korea: The largest exposition dedicated to semiconductor and FPD manufacturing Join Semi January 20-22 in Seoul Korea for Semicon Korea and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more… SEMI Letters Submit Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Top Story   Expect 10% chip market growth, says Penn Malcolm Penn, founder and principal analyst with Future Horizons Ltd, believes the market forces are at last moving into place to deliver ... EETimes India Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation Industry News   Gartner Says Semiconductor Outsourcing Services Revenue to Grow 11% in 2008 Worldwide semiconductor outsourcing services revenue is on pace to total $47.4 billion in 2008, a 10.8% increase from 2007 revenue of $42.8 ... Gartner Qualcomm reaches settlement deal with Nokia Qualcomm Inc. and Nokia Corp. said the two companies have reached a settlement agreement ending a multi-year battle over patents covering ... Market Watch Hard drive industry shrugs off economic concerns, posts double digit growth rates According to iSuppli, 137 million hard drives were shipped during the second quarter of this year, which translates into a healthy 21% gain ... TG Daily STMicro Chips Away At Rivals Franco-Italian semiconductor maker STMicroelectronics won over investors on Wednesday, after a solid second-quarter performance helped it grab ... Forbes Japan chip demand tumbles in June Japanese manufacturers of equipment used to make semiconductors reported a 38% decline in orders in June from the same month last year ... Business Spectator AMD Chief Executive: Major Restructuring Will Spin Off Manufacturing in Months Dirk Meyer, the new chief executive officer of Advanced Micro Devices, said in an interview with a news-paper that the company would spin ... X-bit Labs APM and UMC partner for MEMS wafer fab Asia Pacific Microsystems Inc. (APM) has reached an alliance agreement with semiconductor foundry UMC for 8-inch MEMS wafer fab capacity. ... Small Times Varian Semiconductor Ranked Best Large Supplier of Chip Making Equipment by VLSI Research For the third consecutive year, Varian Semiconductor Equipment Associates, Inc. received the highest aggregate score in the VLSI ... CNN Money MEMC Electronic Materials Misses Street's Q2 Views; Guides; Adds $500M to Buyback MEMC Electronic Materials reports Q2 EPS of $0.92, 8 cents lower than the analyst estimate of $1.00. Revenues for the quarter were $531.4 million ... Street Insider SATS market to beat semiconductor growth The semiconductor assembly and test services (SATS) market is expected to beat the overall semiconductor industry growth rate for this year, ... EETimes India FormFactor dips 14% on analyst downgrade to ‘perform’ FormFactor Inc. is off 14% after analysts at Oppenheimer downgraded the stock after the open to "perform" from "outperform." The research firm ... SmallCapInvestor First Solar Inaugurates First Malaysian Manufacturing Plant First Solar, Inc. announced that the first of its four solar module manufacturing plants being constructed at the Kulim Hi Tech Park in ... Sustainable Business Photo Resist Coating System Featuring Ultrasonic Technology USI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more… Ultrasonic Systems, Inc. Technology News   First successful fabrication of a graphene-on-silicon structure Researchers led by Maki Suemitsu (Tohoku Univ.) have succeeded in fabricating a graphene-on-Si structure for the first time. ... Nanowerk MIT: Optical lithography good to 12 nanometers Optical lithography can be extended to 12 nanometers, according to Massachusetts Institute of Technology researchers who have so far ... EETimes Release Film Boosts IC Molding Productivity A new molding technology that uses a heat-endurance film is on the horizon that may boost IC packaging productivity by making it easier ... Semiconductor International Control Costs and Maximize Yield Discover the XD7600NT If you're looking to reduce first-pass failures and rework/repair then look no further. The Dage XD7600NT is setting the global standard for X-ray inspection with 250 nm feature recognition, 70 degree oblique angle viewing and 2.0 mega pixel resolution. Learn more… Dage Precision Industries Corporate News Submit SUSS MicroTec unveils 300mm Mask Aligner for 3D Packaging SUSS MicroTec unveils the second generation of its MA300 Production Mask Aligner featuring a dedicated alignment kit for creating 3D ... SUSS MicroTec Applied Materials Delivers Critical Copper Barrier Technology Applied Materials, Inc. announced its Applied Endura® Extensa™ PVD1, the industry’s only production-worthy system for depositing the critical ... Applied Materials IMEC reports major progress in EUV IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML’s full ... IMEC Chinese Foundry Selects ATMI and Kinik for Test Wafer Reclaim Program ATMI, Inc. announced it has been selected by one of the largest foundries in China, along with Kinik Company, Ltd., to provide outsourced test ... ATMI Today's Sponsor YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu MEPTEC Presents Semiconductor Packaging Impacting the Age of Consumer Electronics Join MEPTEC for this symposium on February 19 in San Jose, CA. Find out why chipmakers are scaling down their devices to create faster, more efficient and more portable consumer electronics. Learn more… MEPTEC Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.