We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 23, 2008 Case Study & Application Note How flat are your substrates? Packaging coplanarity issues begin with the flatness of your substrates. Learn more… Cyber Technologies Counterfeit Components New white paper provides solutions Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   What New Products Could Apple Have In Mind? For a company as secretive about its upcoming products as Apple Inc., comments from Chief Financial Officer Peter Oppenheimer might as well ... CNN Money Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Industry News   Sony Ericsson to cut 2,000 jobs Sony Ericsson is to cut 2,000 jobs over the next 12 months from its 11,900 workforce as part of a cost reduction programme following poor ... EETimes Taiwan IC distributors work with design houses to gain traction in the China white-box handset market According to local government officials in China, there are about 7-8 million new handset users each month in China, and most of them are ... DigiTimes Balance of power may be shifting to foundries in the semiconductor While a number of market research firms have cut their semiconductor market growth forecasts for 2008, Malcolm Penn, chairman and CEO of ... DigiTimes Microchip Technology: A Smart Chipmaker During times of economic adversity, investors may shy away from semiconductor stocks because of perceived industry risks. Wild swings ... BusinessWeek AMD shares fall to low on market share losses Shares of Advanced Micro Devices Inc. tumbled nearly 4% to a multiyear low as fresh data emerged revealing that the slumping chip maker lost ... AP Allocation, price increases and fights for wafers in 2009 Allocation, rationing, higher prices and a fight for wafers are the inevitable fate of the semiconductor industry next year, according to ... Electronics Weekly Funding for ISMI 450 mm Effort Doubling The 450 mm wafer development effort is increasing funding for the Interoperability Test Bed (ITB) now underway at Sematech’s Austin, ... Semiconductor International Funding accelerates shift from lab to fab for organic semiconductors More than 500 engineers, researchers, business leaders and investors from all over the world are expected to meet in Frankfurt at the end ... SourceWire Peregrine Semiconductor Ships 300 Millionth UltraCMOS RFIC Peregrine Semiconductor Corporation announced that it has shipped its 300 millionth UltraCMOS(TM) RFIC. The milestone was reached with an order ... Market Watch SanDisk Loss Leads Semiconductors Down SanDisk shares plunged 24% due to a surprising second quarter loss that drove down values for related semiconductor makers including Intel ... Trading Markets Register today for International Wafer Level Packaging Conference 4 days, 2 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Technology News   Molding Techniques Support Thin Gold Wires, Low-k Materials New low-pressure molding technologies developed by two Japan-based molding machine manufacturers support thinner IC packages created ... Semiconductor International Differentiating Your LED Design As the light emitting diode (LED) market continues to grow, pressure increases for lighting manufacturers to stay ahead of the curve, ... Embedded Multiarchitecture DSP road map refines power-efficiency-versus-performance balance Texas Instruments’ multiarchitecture-processor plans expand a low-power-design emphasis beyond the fixed-point C550x series of processors and ... EDN Energy applications for nanotech draw interest The U.S. Department of Energy (DOE) is making new efforts to attract entrepreneurs at early stages to commercialise renewable energy ... EETimes India Time is of the essence in ASIC development The fabless semiconductor manufacturer has used Toshiba's renowned process technology and the company's local engineers to create an ... Electronics Talk Researchers generate hydrogen without the carbon footprint A greener, less expensive method to produce hydrogen for fuel may eventually be possible with the help of water, solar energy and ... Media Newswire Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Corporate News Submit Applieds' Producer System Delivers Highest Productivity Etch Applied Materials, Inc. announced that it has expanded its portfolio of applications on the Applied Producer® Etch system to include ... Applied Materials IMEC extends flexible ECG patch to enable arrhythmia detection In the framework of Holst Centre, IMEC has further extended the functionality of its wireless ECG patch for cardiac monitoring. It ... IMEC ATMI Launches Global Centers to Help Semicon Mfrs ATMI, Inc. officially launched four High Productivity Development(tm) Centers in the United States and Asia to provide customers with a ... ATMI SUSS MicroTec unveils 300mm Mask Aligner for 3D Packaging SUSS MicroTec unveils the second generation of its MA300 Production Mask Aligner featuring a dedicated alignment kit for creating 3D ... SUSS MicroTec Quadrant EPP Announces New Advanced Material For Electronics Test Applications Engineers and designers of equipment that require precise, reliable tolerances will have more options for new or upgraded part designs ... Quadrant EPP Fairfax County Middle Schools to Enhance Students' Understanding of Nanotechnology with Award-Winning Book Bourne Research today announced that Fairfax County Middle School Science has selected the award-winning book, MEMS & Nanotechnology for Kids, ... Bourne Research Agilent Announces Availability of New Aerospace/Defense Symposium Agilent released their 2008 Aerospace/Defense Symposium papers on CD. The fifteen technical papers contained on this CD will provide Aerospace ... Agilent Technologies Today's Sponsor Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why… Juki Corporation Vapor Phase Soldering White paper Download Wafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more. A-Tek LLC +/- 0.5 micron placement High accuracy prototyping bonder Three bonders in one: Thermo-sonic, thermo-compression, and epoxy attach. Capable of bonding Flip Chip, MEMs, photonics, sensors, WLP, etc. Additional modules for ACF, ACP, and Au bump bonding. 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