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July 22, 2008


Case Study & Application Note
How flat are your substrates?
Substrates White Paper Packaging coplanarity issues begin with the flatness of your substrates. Learn more…
Cyber Technologies

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Counterfeit Components
New white paper provides solutions
Counterfeit ComponentsSuccess begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper…
Dage Precision Industries
Letters Submit

Design High Flex Cables
On-Line with Web Tool
High Flex CablesGore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more…
W. L. Gore & Associates
Top Story  
Texas Instruments disappoints and predicts weak 3rd quarter
Texas Instruments posted disappointing second-quarter results and gave a weak third-quarter outlook on Monday, blaming a broad-based slowdown ...
International Herald Tribune

Improve Your Uptime
High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
Industry News  
SanDisk posts sharp quarterly loss; shares tumble
SanDisk Corp quarterly results swung sharply to a loss in on Monday amid an unexpected decline in sales and warned worse was in store as it ...
Reuters
Separating Fact from Fiction in the MEMS World: Webinar
Just how fast is the MEMS industry really growing? There’s not much consensus, as evidenced by various market forecasts, which have the ...
iSuppli Corporation
Semi Gear Industry Posts June Book-to-Bill of 0.85
North America-based manufacturers of semiconductor equipment posted $1.03 billion in orders in June 2008 and a book-to-bill ratio of 0.85 ...
SEMI
SATS market seen set for major growth
The semiconductor assembly and test services (SATS) market is expected to beat the overall semiconductor industry growth rate for this year, ...
EETimes
Intel Atom for netbooks costs 52% more than desktop version
The popular Intel Atom microprocessors made for netbooks, or mini-laptops, costs 52% more per chip than the desktop version of the same ...
Network World
Actual data shows May global chip market grew 9.2%
The global market for semiconductors was $20.53 billion in May 2008, according to data from World Semiconductor Trade Statistics up 9.2% on ...
EETimes
SEMI cold-shoulders 450mm
The semiconductor industry cannot afford the R&D costs for both shrinking transistors and moving to 450mm wafers according to a report from ...
Electronics Weekly
AMD on road to recovery, says research firm
While AMD's processor business is showing strength, the company is still in a worse position than Intel to face a dip in demand for the rest of ...
ZDNet
TI reports financial results for 2Q08
Texas Instruments announced second-quarter revenue of $3.35 billion, net income of $588 million and earnings per share of $0.44. “Our core ...
Texas Instruments
In good shape
In its three decades, electronic design automation has rarely strayed far from the headlines. And that's the case today, with Cadence pursuing a ...
New Electronics
Global Hotel TV Market to Grow Nearly 11-Fold by 2012, Says iSuppli
Rising occupancy and increased travel rates among both business people and consumers is spurring the global hotel industry to upgrade the ...
Tech On
Semiconductor and CE companies can improve cost, time-to-market and product quality
During the last few years, demand for CE products has surpassed the demand for PCs as consumers around the world benefited from the ...
SmartBrief
Clouds on the horizon for European solar energy equipment suppliers
For semiconductor fabrication equipment manufacturers, systems that make solar cells are an excellent market for diversification, ...
Heise Online
MEMSCAP Announces Its Second Quarter 2008 Earnings
MEMSCAP announced its earnings for the second quarter ending June 30, 2008. A quarterly revenue growth of over 20% in dollars year to year ...
MEMSCAP

Register today for
International Wafer Level Packaging Conference
4 days, 2 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here!
SMTA
Technology News  
Shimmering ferroelectric domains
Ferroelectric materials are named after ferromagnetic ones because they behave in a similar way. The main difference: these materials are not ...
ZPEnergy
First STM spectroscopy of graphene flakes yields new surprises
Michael Crommie, a faculty scientist in Berkeley Lab's Materials Sciences Division and a professor in the Department of Physics at UC ...
PhysOrg
Low-cost, silicon-based LEDs expected within two years
The technique overcomes prohibitive costs of current LED technology by building the diodes on low cost silicon wafers, instead of currently- ...
iT News
Molding Techniques Support Thin Gold Wires, Low-k Materials
New low-pressure molding technologies developed by two Japan-based molding machine manufacturers support thinner IC packages created ...
Semiconductor International
Largest Silicon Drift Detector Delivered to NASA by Princeton Gamma-Tech Instruments
Princeton Gamma-Tech Instruments announces expanded capabilities in silicon drift detectors for X-Ray Spectroscopy; large 100mm2 surface ...
Market Watch

Semiconductor Packaging News
Advertising delivers!
Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more…
Semiconductor Packaging News

Corporate News Submit
Asymtek's New DispenseJet DJ-9500is up to Ten Times Faster
Asymtek introduces its new DispenseJet® DJ-9500 fluid jetting valve for high-speed underfill applications and jetting silicone for LEDs. The ...
Asymtek
Delta Design Introduces the MATRiX High Speed Test Handler
Cohu, Inc. announced that its Delta Design subsidiary has launched its next generation high speed test handler, the MATRiX. "We were ...
Delta Design
75th Order Affirms Value of MVP
Machine Vision Products, Inc. announced that it has received its 75th system order for its recently-introduced Ultra 850G Packaging and ...
Machine Vision Products, Inc.
EV Group Files Patent Infringement Lawsuit Against 3M Company
EV Group (EVG) announced that it has filed a patent infringement lawsuit in federal court of New York against the 3M Company ("3M"). The ...
EV Group
IMEC reports new promising method to fabricate ultra-thin silicon solar cells
IMEC is developing a new method to produce ~50µm thin crystalline silicon wafers for use in solar cells. The process involves mechanically ...
IMEC
Today's Sponsor

High-Speed Stamp Soldering
New white paper
Stamp Soldering White PaperThis paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more…
Juki Corporation

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Does your reflow offer guarantees?
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ATEK Reflow• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
ATEK Systems Group

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+/- 0.5 micron placement
High accuracy prototyping bonder
Prototyping BonderThree bonders in one: Thermo-sonic, thermo-compression, and epoxy attach. Capable of bonding Flip Chip, MEMs, photonics, sensors, WLP, etc. Additional modules for ACF, ACP, and Au bump bonding. Learn more…
Finetech


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