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Improve Your Uptime High Precision Dispense Tips
The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology
SanDisk posts sharp quarterly loss; shares tumble
SanDisk Corp quarterly results swung sharply to a loss in on Monday amid an unexpected decline in sales and warned worse was in store as it ...
Reuters
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Separating Fact from Fiction in the MEMS World: Webinar
Just how fast is the MEMS industry really growing? There’s not much consensus, as evidenced by various market forecasts, which have the ...
iSuppli Corporation
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Semi Gear Industry Posts June Book-to-Bill of 0.85
North America-based manufacturers of semiconductor equipment posted $1.03 billion in orders in June 2008 and a book-to-bill ratio of 0.85 ...
SEMI
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SATS market seen set for major growth
The semiconductor assembly and test services (SATS) market is expected to beat the overall semiconductor industry growth rate for this year, ...
EETimes
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Intel Atom for netbooks costs 52% more than desktop version
The popular Intel Atom microprocessors made for netbooks, or mini-laptops, costs 52% more per chip than the desktop version of the same ...
Network World
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Actual data shows May global chip market grew 9.2%
The global market for semiconductors was $20.53 billion in May 2008, according to data from World Semiconductor Trade Statistics up 9.2% on ...
EETimes
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SEMI cold-shoulders 450mm
The semiconductor industry cannot afford the R&D costs for both shrinking transistors and moving to 450mm wafers according to a report from ...
Electronics Weekly
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AMD on road to recovery, says research firm
While AMD's processor business is showing strength, the company is still in a worse position than Intel to face a dip in demand for the rest of ...
ZDNet
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TI reports financial results for 2Q08
Texas Instruments announced second-quarter revenue of $3.35 billion, net income of $588 million and earnings per share of $0.44. “Our core ...
Texas Instruments
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In good shape
In its three decades, electronic design automation has rarely strayed far from the headlines. And that's the case today, with Cadence pursuing a ...
New Electronics
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Global Hotel TV Market to Grow Nearly 11-Fold by 2012, Says iSuppli
Rising occupancy and increased travel rates among both business people and consumers is spurring the global hotel industry to upgrade the ...
Tech On
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Semiconductor and CE companies can improve cost, time-to-market and product quality
During the last few years, demand for CE products has surpassed the demand for PCs as consumers around the world benefited from the ...
SmartBrief
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Clouds on the horizon for European solar energy equipment suppliers
For semiconductor fabrication equipment manufacturers, systems that make solar cells are an excellent market for diversification, ...
Heise Online
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MEMSCAP Announces Its Second Quarter 2008 Earnings
MEMSCAP announced its earnings for the second quarter ending June 30, 2008. A quarterly revenue growth of over 20% in dollars year to year ...
MEMSCAP
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Register today for International Wafer Level Packaging Conference
4 days, 2 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA
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Semiconductor Packaging News
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Today's Sponsor
High-Speed Stamp Soldering New white paper
This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more
Juki Corporation
Does your reflow offer guarantees? Ours Does
Oxygen Free Process. Zero deg Delta T at Peak temperature. Not to exceed Max temp for all components. Programmable ramp rates between 1-4 deg c/sec. Click here to learn more
ATEK Systems Group
+/- 0.5 micron placement High accuracy prototyping bonder
Three bonders in one: Thermo-sonic, thermo-compression, and epoxy attach. Capable of bonding Flip Chip, MEMs, photonics, sensors, WLP, etc. Additional modules for ACF, ACP, and Au bump bonding. Learn more
Finetech
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