We search for industry news, so you don't need to.   YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Hesse & Knipps BONDJET BJ920 heavy wire bonder integrates pull and shear test Hesse & Knipps BONDJET BJ920 heavy wire bonder gives you speed, accuracy and the largest bonding area - it is also the only bonder with integrated pull and shear test. Learn more… Hesse & Knipps White Paper: Photo Resist coating Precision coating with Ultraspray Technology Outlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper… Ultrasonic Systems, Inc.   Industry and Technology News Index July 23, 2008  -  Click the title to read the full article. Differentiating Your LED Design As the light emitting diode (LED) market continues to grow, pressure increases for lighting manufacturers to stay ahead of the curve, ... Embedded We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Embedded November 11, 2008 - Industry News Pioneers of MEMS mikes keep the faith One of the perks of this job is that I get to meet some really interesting people. Last week was no exception, as I got to meet two engineers who ... Embedded November 7, 2008 - Technology News Using comparators to detect accessories in portable audio applications A common feature in most of the electronic devices we use - cell phones, PDAs, notebooks, handheld media players, game systems, etc. - is the ... Embedded October 24, 2008 - Technology News Thin-film thermoelectric coolers get smaller and more powerful with technology advances Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the ... Embedded Computing Design October 3, 2008 - Technology News TI Driving Development, Ratification Of New IEEE 1149.7 Standard As chips add new functionality and system designs evolve away from boards and toward multi-chip system-on-chip (SoC) architectures, developers ... Embedded Technology September 24, 2008 - Technology News Components: World's thinnest MEMS oscillator debuts Touted as the world's thinnest MEMS oscillator at just 0.25 millimeters, a new device is being targeted at applications such as smart cards, ... Embedded September 23, 2008 - Technology News Image capture and processing challenges--and solutions--in portable designs Here is Part II of a four-part article series looking at the trends and design challenges of image acquisition and processing on cell phones ... Embedded September 8, 2008 - Technology News Reinventing JTAG for SoC debugging Want a headstart on implementing a new JTAG debug interface into your design? Here's the lowdown on the soon-to-be IEEE 1149.7 standard. ... Embedded August 27, 2008 - Technology News Layout guidelines help manage video equalizer's return loss A brief examination of the exercise performed to optimize the design of the Cypress Video Equalizer evaluation board demonstrates how the ... Embedded August 26, 2008 - Technology News Easing the challenge of RF design: Wireless Links and Antennas The very mention of RF design is usually enough to scare all but the most confident designer. However, wireless specialists such as the company ... Embedded August 5, 2008 - Technology News ASICs: eASIC delivers 45nm Structured ASIC with zero mask charges New Nextreme-2 family of Structured ASICs from eASIC aimed at reversing decline of worldwide ASIC design starts. The last few years have seen ... Embedded August 1, 2008 - Technology News Practical considerations for capacitive touchscreen system design Projected-capacitance touchscreens require careful consideration of mechanical design, substrate selection and user interface design; ... Embedded July 31, 2008 - Technology News State of embedded VITA, the governing body of the VMEbus standard, has just released an addendum to its annual State of the Industry. It's authored by Ray ... Embedded July 25, 2008 - Industry News Shrink mobile devices with MEMS Out-of-the-box thinking is clearly needed if mobile phone design is to enable the ubiquitous services that future subscribers are going to ... Embedded July 23, 2008 - Technology News Differentiating Your LED Design As the light emitting diode (LED) market continues to grow, pressure increases for lighting manufacturers to stay ahead of the curve, ... Embedded July 8, 2008 - Industry News Consumer FCRAM delivers fast data transfer with low power Fujitsu Microelectronics America Inc. (FMA) has introduced a 256-Mbit consumer FCRAM featuring low power and high throughput for digital ... Embedded June 27, 2008 - Technology News How to select CPLDs for handheld applications The rapid proliferation of handheld products, including mobile phones, personal media players, handheld video game players, and digital still ... Embedded June 25, 2008 - Technology News Using auto-zero comparator techniques to improve PWM performance Comparators are subject to input offset errors that can be either systematic or layout related. Two applications of comparators in a ... Embedded May 19, 2008 - Technology News SKY Computers Launches LightningBolt, the Next Generation of Embedded Computers SKY Computers Inc., a leading supplier of embedded high performance computer systems, today announced LightningBolt™, the next generation ... Military Embedded Systems May 15, 2008 - Technology News Characterizing Nanometer CMOS PLLs, Sigma-Delta ADCs & AGCs A critical limitation in taping out high-performance mixed-signal ICs is the characterization of complex analog/RF blocks such as phase ... Embedded March 31, 2008 - Technology News Nextreme Awarded Seminal Patent in Nanotechnology to Boost Efficiency of Thermoelectrics Nextreme Thermal Solutions(TM), the leader in microscale thermal and power management products for the electronics industry, announces ... Embedded Computing Design February 5, 2007 - Technology News National Semiconductor Introduces Industry’s First Constant Output Class D Audio Amplifier National Semiconductor Corporation introduced the first product in a new line of Boomer® Class D audio amplifiers with integrated ... Embedded Computing Design November 10, 2006 - Industry News Mouser SignsDistribution Agreement with Seoul Semiconductor Mouser Electronics, Inc., the fastest growing catalog distributor in the electronics industry, today announced it has entered into a global ... Embedded Computing Design November 8, 2006 - Technology News AMD's CTO predicts 'attack of the killer micros' Get ready for round two of the "attack of the killer micros," said Phil Hester, Advanced Micro Devices CTO, in a keynote speech at the ... Embedded To find more articles from Embedded, use the search form below. Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. 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