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Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
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  Industry and Technology News Index
July 23, 2008  -  Click the title to read the full article.

Allocation, price increases and fights for wafers in 2009
Allocation, rationing, higher prices and a fight for wafers are the inevitable fate of the semiconductor industry next year, according to ...
Electronics Weekly
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November 17, 2008 - Technology News
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November 11, 2008 - Industry News
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November 7, 2008 - Industry News
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November 4, 2008 - Industry News
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October 24, 2008 - Top Story News
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September 25, 2008 - Industry News
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September 18, 2008 - Industry News
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September 16, 2008 - Top Story News
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