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July 22, 2008

75th Order Affirms Value of MVP
Semiconductor Micro-electronics and Packaging Inspection Systems

Carlsbad, CA -- Machine Vision Products, Inc. A worldwide leader in Automated Optical inspection for the Micro-electronics, Semiconductor and SMT manufacturing industries today announced that it has received its 75th system order for its recently-introduced Ultra 850G Packaging and Micro-electronics Automated Optical Inspection (Micro-electronics AOI) platform. These orders reflect the success of this product in providing unique defect coverage and metrology in the Flux, Paste, Die Placement, Component and Underfill processes.

"These multiple orders have shown our capability to increase yields across all aspects of the back-end semiconductor packaging processes and puts us ahead of our own projections for this market segment," commented Dr. George T. Ayoub, President, Machine Vision Products, "more significantly, it affirms the value added by the Ultra 850G to our quality conscious customers. Clearly, the productivity, accuracy and reliability of the Ultra 850G have proven themselves in volume manufacturing, and we expect further rapid adoption of the Ultra 850G in these important market segments."

The Ultra 850G is the latest addition to MVP's industry-leading line of Automated Optical Inspection tools, asserting its position as a total solution provider. The Ultra 850G is configurable to be deployed in all aspects of the packaging processes from Paste/Flux through the C4 assembly process, Die attach and finally at the Underfill process. The Ultra 850G integrates the company's easy-to-use programming tools and analytical process control tools in this platform. This convergence of technology from Machine Vision Products, Inc. delivers the best available combination of defect detection capabilities, metrology for process control and inspection throughput at a low cost of ownership.

Machine Vision Products, Inc are exhibiting the Ultra 850G platform at the Semicon West Exhibition at the Moscone Center, San Francisco, California during July 15-17, 2008 in the West Hall Level 2, booth 8426.

Contact:
Machine Vision Products, Inc.


http://www.visionpro.com

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M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
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