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July 15, 2008

Fab Owners Association To Host Device-Maker Forum At Semicon West

SAN FRANCISCO, CALIF. - The Fab Owners Association (FOA), the association of semiconductor/MEMs manufacturing executives and suppliers, will host a forum at Semicon West ( www.semi.org) on Thursday, July 17. Structured as part of the FOA's quarterly meeting, doors will open to the public at 2:30pm in Room of Moscone South Hall.

The topic of the forum, "Changing Market Trends- how device makers will leverage today's technology for tomorrow's markets", will feature the following FOA member executives:

  • William Dunnigan, SVP, Manufacturing, Cypress Semiconductor
  • Guy Gandenberger, VP, Worldwide Operations, Micrel Semiconductor
  • Chris Magnelis, OHT- Fab, Director of Operations, Freescale
  • Sagar Pushpala, VP, Worldwide Operations, Intersil

"The FOA Board of Directors, who compose most of the panel, will address the challenges that semiconductor manufacturers face in today's environment," stated L.T. Guttadauro, FOA executive director. "At the same time, they want to encourage suppliers to continue to innovate using existing manufacturing technologies for the day-after-tomorrow's applications."

The FOA's device-maker members are the following companies: Anadigics, Inc.; Austriamicrosystems AG; Avago Technologies; Cypress Semiconductor; Delphi Microelectronics Center; Diodes, Inc.; Fairchild Semiconductor; Freescale Semiconductor; Infineon Technologies; International Rectifier; Intersil; Jazz Semiconductor; Maxim Integrated Products; Micrel Semiconductor; Microchip Technology; ON Semiconductor; SVTC Technologies; Skyworks Solutions; and X-FAB.

FOA device-maker member companies represent the production of over 1.2 million eight-inch-equivalent monthly wafer starts and US#32 Billion in annual revenues.

Contact:
Fab Owners Association


http://www.waferfabs.org/

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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech




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