NORTH BILLERICA, Mass.—BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today was presented with an Advanced Packaging Award in the Reflow Equipment category for its Pyramax 100 reflow oven. The award was presented during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

“The Pyramax 100 has been very well received by our customers,” said Rob DiMatteo, Product Manager for Electronics Assembly. “The unit truly represents an ideal set-up for lead-free processing with superior process control and very low Cost of Ownership.

“The Pyramax Series of reflow ovens features BTU’s exclusive closed loop convection control for precise control of heating and cooling. Add to this, low consumption of nitrogen and power, and you get the kind of productivity and efficiency that our customers expect from BTU,” added DiMatteo.

Now in its eighth year, the Advanced Packaging Awards program is an annual celebration of product excellence in semiconductor packaging. Premier products based on the finest examples of creative advancement in technology in 21 key areas are chosen by a distinguished panel of industry experts.