We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 21, 2008 Case Study & Application Note How flat are your substrates? Packaging coplanarity issues begin with the flatness of your substrates. Learn more… Cyber Technologies Beat the Counterfeiters New white paper provides solutions Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   IC makers face "More than Moore" era The relentless pursuit of scaling over the last 40 years, in accordance with the famed postulate known as Moore's Law, continues to be an ... EETimes India Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Industry News   Malaysia Launches Latest Semiconductor Package Malaysia unveiled a state- of-the-art semiconductor package which is smaller in size yet capable of having a higher capacity. The "QFN 3-D ... Bernama Heard at SemiCon West: 300 mm or 450 mm wafers—what do the models tell us? In a panel discussion Thursday morning, representatives of a SEMI study group presented a strong case against an early move to 450 mm wafers. ... EDN Solar Grade: A Silicon Revolution For those of you not too familiar with the technicals of the silicon solar Photovoltaic industry, I would like to bring to your attention ... Seeking Alpha New AMD chief sees clear path to recovery Dirk Meyer wore jeans and cowboy boots to the office the day he was named chief executive of Advanced Micro Devices Inc. It's his usual work ... Statesman General ICs: Price rise looms on certain products According to Converge Market Insights, as the general IC market heads into the summer months, we have yet to see any dramatic changes in ... CyberMedia India Online Agilent moves from background to role on global stage When the world's eyes are on Beijing next month, most people won't know that a company based in Santa Clara made the scientific equipment ... Mercury News Intel marks 40 years of chip making Intel already the world’s biggest semiconductor company, has big plans for the future as it celebrates 40 years in the chip making business. ... Kazinform Whats next in ATE shakeout? The shakeout in the automatic test equipment (ATE) business is over. Or is it? At the Semicon West trade show here, there were rumors that Japan's ... EETimes Register today for International Wafer Level Packaging Conference 4 days, 2 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Technology News   Another breakthrough purportedly brings us closer to quantum computing In reality, quite a bit of time has passed since we've heard of the next great leap in the (seemingly) never-ending journey towards quantum ... Engadget C-to-Silicon Compiler can take EDA to next level Cadence Design Systems Inc. recently announced the C-to-Silicon Compiler, which is said to be the next-generation of HLS (high-level synthesis) ... CyberMedia India Online Improving Quantum Dot Synthesis Materials researchers at the National Institute of Standards and Technology (NIST) have developed a simplified, low-cost process for ... Nanotechwire Shimmering ferroelectric domains Dr. Lukas M. Eng and his group at the Technische Universität Dresden used the free-electron laser at the Forschungszentrum Dresden- ... PhysOrg Graphene confirmed to be one of the strongest materials known to science Two new studies have suggested that the carbon supermaterial graphene is also one of the strongest, most elastic and stiffest materials known ... TopNews Postmortem debugging of embedded RTOS applications Postmortem debugging in desktop operating systems such as Windows and Linux has been around for some time. If the OS crashes, a kernel ... EETimes Jedec group will set flash drive standards Jedec, the standards group best known for its work on DRAM interfaces, has formed a new group to set standards for solid-state disks that ... EETimes Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Corporate News Submit IMEC Reduces Cost of Double Patterning Lithography IMEC, in collaboration with JSR Corp. (Tokyo), realized a simplified process using only one etch step to reduce the cost of double patterning ... IMEC Applied Materials Wins Key System Support Contract with Inotera Applied Materials, Inc. announced it has signed a two-year system support contract with Inotera Memories, Inc., a leading DRAM manufacturer in ... Applied Materials Today's Sponsor High-Speed Stamp Soldering New white paper This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. 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