We search for industry news, so you don't need to.   Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture faliures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more… Dage Precision Industries Cyber Technologies is leader in laser-based, high-resolution 3D inspection for microelectronics Our world-class clients rely on our CyberScan Vantage Systems for inspection of: Substrate Flatness, Bump and Ball Coplanarity, Wire Bond Loop Height, Film and Paste Thickness & Volume and Transparent Materials Deposition. Learn more... Cyber Technologies   Industry and Technology News Index July 22, 2008  -  Click the title to read the full article. Semi Gear Industry Posts June Book-to-Bill of 0.85 North America-based manufacturers of semiconductor equipment posted $1.03 billion in orders in June 2008 and a book-to-bill ratio of 0.85 ... SEMI We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from SEMI January 8, 2009 - Industry News Wafer-Level Packaging Trends Up in 2009 Wafer-level packaging trends include increasing demand, higher I/O, finer pitch, increased power for automotive applications, and high-accuracy ... Semiconductor International January 6, 2009 - Technology News Cracking A Tough Nut For The Semiconductor Industry Researchers at the National Institute of Standards and Technology (NIST) have developed a method to measure the toughness-the resistance to ... Semiconductor Online December 30, 2008 - Industry News Japan’s 3-D R&D Consortium Takes Shape The manager of Japan’s government-backed 3-D IC technology development project outlined the project’s goals, and companies ranging from ... Semiconductor International December 29, 2008 - Corporate News SiGe Semiconductor announces record revenues and shipments for 2008 SiGe Semiconductor, Inc. announced another record-setting year of growth, with greater than 350 million units shipped since the ... SiGe Semiconductor December 24, 2008 - Industry News Flash Vendors Facing Scaling Challenges With flash memory scaling coming under increasingly sharp questioning, Toshiba Corp. (Tokyo) researchers said they have developed a double ... Semiconductor International December 24, 2008 - Technology News Ulvac Enables Flexible Li-Ion Battery Ulvac Inc. has developed a manufacturing process flow for very thin (50 ìm) lithium-ion rechargeable batteries, using semiconductor process ... Semiconductor International December 19, 2008 - Industry News Leading-Edge Logic Processes Presented at IEDM Session An all-star cast of companies presented leading-edge processes yesterday at a session on advanced CMOS logic at the International Electron ... Semiconductor International December 18, 2008 - Industry News STATS ChipPAC to Lay Off 1600 in Latest Restructuring Stats ChipPAC Ltd. (Singapore), which provides semiconductor test and advanced packaging services, has responded to the global semiconductor ... Semiconductor International December 18, 2008 - Industry News IEDM Panel: Processing Costs Headed Up With more expensive tools and new process modules coming, IC manufacturers will struggle to maintain the cost-per-function ... Semiconductor International December 17, 2008 - Corporate News DALSA Semiconductor to license Alchimer's eG ViaCoat technology DALSA Semiconductor is pleased to announce successful tests in creating conformal copper seed layers on through-silicon via structures using ... DALSA Semiconductor December 11, 2008 - Industry News New Dynamics Changing the Secondary Equipment Market The worldwide economic slowdown, credit crisis, and new production strategies are having an enormous impact on the market for used, ... SEMI December 11, 2008 - Exclusive Articles/Announcements 5 reasons to consider Internet marketing in a down market When marketing and advertising budgets are stretched to the limit, you have no alternative than to use programs that are direct and measurable. This is why e-media is winning the battle for marketing budgets: Internet based marketing, including email, ... Semiconductor Packaging News December 11, 2008 - Technology News Intel to Describe 32 nm Logic Process, New 45 nm SoC Platform, at 2008 IEDM Intel Corp. (Santa Clara, Calif.) will go to next week’s International Electron Devices Meeting (IEDM) with a late paper that divulges some ... Semiconductor International December 11, 2008 - Industry News Applied Announces TSV Etcher, In-Fab Mask Inspection Capability In twin announcements, Applied Materials Inc. announced an etch system aimed at through-silicon via (TSV) applications. Also, Applied said it ... Semiconductor International December 9, 2008 - Technology News Japan’s 3-D R&D Consortium Takes Shape At SEMICON Japan, managers of the government-backed 3-D IC technology development project outlined the project's goals. Also at the show, ... Semiconductor International December 9, 2008 - Industry News Japan’s 3-D R&D Consortium Takes Shape The manager of Japan’s government-backed 3-D IC technology development project outlined the project’s goals, and companies ranging from ... Semiconductor International December 2, 2008 - Industry News October Semiconductor Sales Decline 2.4% Year-on-Year Worldwide sales of semiconductors declined by 2.4% in October to $22.5 billion compared to sales of $23.0 billion in October 2007, the ... Semiconductor Industry Association December 2, 2008 - Technology News Applied Announces TSV Etcher, In-Fab Mask Inspection Capability In twin announcements today, Applied Materials Inc.announced an etch system aimed at through-silicon via (TSV) applications. Also, Applied ... Semiconductor International December 1, 2008 - Industry News Jonathan Davis Named President of SEMI North America SEMI announced the appointment of Jonathan Davis to the position of president of SEMI North America effective January 1, 2009. Davis ... SEMI November 24, 2008 - Technology News ST joins MIT, ultra-low-power MCU devices group STMicroelectronics announced it has joined the Microsystems Industrial Group (MIG) industry consortium at the Microsystems Technology Labs ... Semiconductor International November 21, 2008 - Industry News SIA Forecast: 2009 Down Almost 6% Although visibility is limited by current questions about consumer confidence, the Semiconductor Industry Association announced its ... Semiconductor International November 21, 2008 - Top Story News Industry Downturn No. 11 Won't Be as Bad as No. 10 Just as people can't help but compare the current global economic recession to the Great Depression, reviewing the semiconductor ... Semiconductor International To find more articles from SEMI, use the search form below. Heraeus - Celebrating 40 years of USA Manufacturing Excellence Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. While competitors are mainly focusing off shore, Heraeus is committed to serving all markets. Learn more about Heraeus materials… Heraeus, Inc. Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.