November 19, 2008 - Top Story News
3-D Integration Lacking in Design and Test Support
At a symposium leading up to the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., ...
Semiconductor International
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November 18, 2008 - Technology News
3-D Integration Development Threatened by Economic Uncertainty
As presenters and attendees prepare for the opening of this year's 3-D Architectures for Semiconductor Integration and Packaging conference, ...
Semiconductor International
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November 14, 2008 - Industry News
Silicon Wafer Shipments Contract in Third Quarter 2008
Worldwide silicon wafer area shipments contracted almost three percent during the third quarter of 2008 when compared to the second quarter ...
Semiconductor International
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November 12, 2008 - Technology News
Touch Panel Displays Gain Reliability
Touch panel displays with improved reliability and endurance emerged at the FPD International 2008 show, held recently in Yokohama, Japan ...
Semiconductor International
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November 11, 2008 - Industry News
IBM Offers 45 nm SOI Foundry Offering
IBM Corp. said it is offering a 45 nm silicon on insulator (SOI) technology to foundry customers, including SOI-aware standard cell libraries from ...
Semiconductor International
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November 7, 2008 - Industry News
China’s Chip Industry Facing Challenges
China's semiconductor industry has reached a plateau, with local design houses finding it hard to reach the critical mass enjoyed by U.S. ...
Semiconductor International
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November 6, 2008 - Industry News
IC Industry Entering ‘Capitulation Mode’
The semiconductor industry is cutting back investments, engaging in what Bill McClean, president of IC Insights, called "capitulation mode," ...
Semiconductor International
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November 5, 2008 - Technology News
TMV: An ‘Enabling’ Technology for Next-Gen PoP Requirements
Demand for package-on-package (PoP) is still rising, thanks in large part to wildly popular smartphones like Apple’s (Cupertino, Calif.) iPhone ...
Semiconductor International
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November 4, 2008 - Industry News
MEMC Electronic chief has resigned
Nabeel Gareeb, President and CEO for 6 years was the area's highest-paid executive in 2007. MEMC announces board member Marshall will be ...
Semiconductor International
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October 31, 2008 - Technology News
Magnetism and Nanocrystals Promise Denser Storage, New Devices
An Oak Ridge National Laboratory research team is working on creating a new class of nanomaterials. Simple materials such as gold and silicon ...
Semiconductor International
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October 30, 2008 - Industry News
Chip Package Designer Unwraps Image Effort
Chipmaker Tessera picked a tough time to try to find stability. Just as the economy has tanked, the company forged ahead with plans to ...
Semiconductor International
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October 30, 2008 - Industry News
TI Blitzes to Improve Fab Productivity
Texas Instruments Inc. has used rapid improvement events, or kaizen blitzes, to sharply improve productivity at the DFAB in Dallas. ...
Semiconductor International
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October 28, 2008 - Industry News
Oerlikon Sells Optics Business at Balzers
Oerlikon OC said it agreed to sell its optical coatings business located at Balzers, Liechtenstein, to a management buyout group. Oerlikon said ...
Semiconductor International
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October 28, 2008 - Industry News
ISMI Outlines 450 mm Wafer, NGF Roadmaps
ISMI managers described progress at the 450 mm wafer Interoperability Text Bed, and described the Phase 2 roadmap at last week's ISMI ...
Semiconductor International
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October 27, 2008 - Industry News
MagnaChip ends imaging work in effort to save $50M
In making the exit, the company said it incurred impairment charges of $26.3 million in its Q3 and expects to record approximately $15.2 ...
Semiconductor International
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October 24, 2008 - Industry News
3-D Startup Is Ahead of Its Time
As the 3-D integration infrastructure evolves, it is becoming clear that low-cost, reliable bonding technology is required for 3-D IC ...
Semiconductor International
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October 23, 2008 - Industry News
Metrology Conference Preparations Are Underway
The second call for papers has gone out for Frontiers of Characterization and Metrology for Nanoelectronics, a conference that I consider as the ...
Semiconductor International
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October 23, 2008 - Industry News
Environmental Regulations Growing More Complex
Participants at an ISMI meeting on emerging environment, safety and health (ESH) regulations said the Stockholm Convention on Persistent ...
Semiconductor International
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October 21, 2008 - Industry News
Webcast: SIA Annual Semiconductor Industry Global Sales Forecast
The global economy is entering a period of unprecedented uncertainty, driven largely by the crisis in subprime home mortgages here in the ...
Semiconductor International
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October 16, 2008 - Industry News
IMEC Views 3-D Stacking as System Design
IMEC managers said the research center has made significant progress creating test 3-D ICs, using die-to-die stacking. IMEC's Eric Beyne ...
Semiconductor International
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October 16, 2008 - Top Story News
Interposers Play a Key Role in 3-D ICs
Interposers, which redistribute interconnects in stacked chips, are proving important to the commercialization of 3-D ICs using through ...
Semiconductor International
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October 15, 2008 - Technology News
How Might 3-D ICs Come Together?
The first production applications for 3-D ICs, CMOS image sensors and stacked memory, are not waiting for a fully developed infrastructure. ...
Semiconductor International
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October 15, 2008 - Industry News
TechSearch: Steady Growth Ahead for Flip-Chips, WLP
Flip-chips and wafer-level packaging (WLP) are each on target to grow at a steady annual rate of 14% from 2007 to 2012, according to a new ...
Semiconductor International
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October 14, 2008 - Industry News
Global Conditions Dampen Europa
Despite an upbeat attitude on the part of most executives, a dark cloud caused by the global economic conditions hung over SEMICON Europa in ...
Semiconductor International
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October 14, 2008 - Industry News
Qimonda Announces Global Restructuring Program and Agrees to Sell Its Stake in Inotera Memories to Micron Technology
Qimonda AG announced a global restructuring and cost reduction program. The program is intended to reposition Qimonda in the market and ...
Semiconductor International
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