We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers High-Speed Stamp Soldering New white paper This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more… Juki Corporation YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech   Corporate News Index July 21, 2008  -  Click the title to read the full article. IMEC Reduces Cost of Double Patterning Lithography IMEC, in collaboration with JSR Corp. (Tokyo), realized a simplified process using only one etch step to reduce the cost of double patterning ... IMEC This page has been viewed 33 times. We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from IMEC November 14, 2008 - Corporate News IMEC, Panasonic Sign Comprehensive Joint Research Contract IMEC and Panasonic Corporation have signed a joint research contract concerning the most advanced technologies in the semiconductor, ... IMEC November 3, 2008 - Corporate News IMEC calls for true European collaborations To increase Europe’s microelectronics competitiveness, the Belgian nanoelectronics research center IMEC asks Europe and its governing ... IMEC October 31, 2008 - Corporate News Body area network monitors arousal level In the framework of Holst Centre, IMEC developed an ambulatory arousal monitor. The new research concept uses a combination of body ... IMEC October 21, 2008 - Corporate News Body area network monitors arousal level In the framework of Holst Centre, IMEC developed an ambulatory arousal monitor. The new research concept uses a combination of body ... IMEC October 20, 2008 - Exclusive Articles/Announcements Semantic wireless body area networks: beyond real-time monitoring of personal health In the framework of Holst Centre, IMEC in collaboration with the Belgian SME i.Know are working on the concept of semantic body area networks allowing the user to gain structured information on his/her health status. The method is illustrated through the concept of ECG monitoring, where an ECG signal is acquired using IMEC’s wireless ECG patch ... Holst Centre/IMEC-NL October 20, 2008 - Corporate News IMEC presents scalable architecture for flexible forward error correction IMEC has developed an innovative architecture for flexible forward error correction (FEC). The solution targets data transmission applications ... IMEC October 17, 2008 - Corporate News IMEC reports record power for micromachined piezoelectric energy harvester In the framework of Holst Centre, IMEC achieved a new record for micromachined piezoelectric energy harvesters, now delivering an ... IMEC October 16, 2008 - Corporate News IMEC reports method to extend lifetime of organic solar cells IMEC's associated laboratory IMOMEC developed a method to stabilize the nanomorphology of organic solar cells resulting in a lifetime ... IMEC October 15, 2008 - Corporate News Toshiba licenses IMEC's power-efficient, flexible processor technology IMEC announced that Toshiba, world-leading integrated device manufacturer, has licensed IMEC technology for designing power-efficient ... IMEC October 14, 2008 - Corporate News IMEC demonstrates 3D stacked integrated circuits IMEC announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. IMEC recently demonstrated the first ... IMEC October 8, 2008 - Corporate News IMEC paves the way towards optical sensing foils IMEC's associated laboratory at the Ghent University, INTEC, has made the first functional optical links embedded in a flexible substrate. The ... IMEC October 6, 2008 - Corporate News IMEC and Taiyo Nippon Sanso Corp. collaborate on green LED manufacturing technology IMEC and Taiyo Nippon Sanso Corp. announce that they have signed an agreement to jointly develop manufacturing technology for high ... IMEC September 5, 2008 - Corporate News IMEC and CEA-LETI gear up cost-effective silicon photonics prototyping service IMEC and CEA-LETI launch ePIXfab, the continuation of their successful multi-project wafer silicon photonics prototyping service started in ... IMEC September 2, 2008 - Corporate News IMEC and Plextronics collaborate on high-efficiency reproducible organic solar cells IMEC, and Plextronics, Inc. signed an agreement to collaborate on state-of-the-art materials and inks for organic solar cells. With this ... IMEC and Plextronics August 26, 2008 - Corporate News eHealth closer to reality thanks to real-time relevant medical data extraction In the framework of Holst Centre, IMEC has broadened the functionality and scope of its wireless health monitoring technology by linking it ... IMEC July 30, 2008 - Corporate News IMEC Hosts 18th Annual Research Business Forum In October On October 15-17, 2008, the 18th edition of IMEC's Annual Research Review Meeting will take place at the Radisson SAS Royal hotel in Brussels, ... IMEC July 24, 2008 - Corporate News IMEC reports major progress in EUV IMEC reports functional 0.186µm2 32nm SRAM cells made with FinFETs from which the contact layer was successfully printed using ASML’s full ... IMEC July 23, 2008 - Corporate News IMEC extends flexible ECG patch to enable arrhythmia detection In the framework of Holst Centre, IMEC has further extended the functionality of its wireless ECG patch for cardiac monitoring. It ... IMEC July 22, 2008 - Corporate News IMEC reports new promising method to fabricate ultra-thin silicon solar cells IMEC is developing a new method to produce ~50µm thin crystalline silicon wafers for use in solar cells. The process involves mechanically ... IMEC July 21, 2008 - Corporate News IMEC Reduces Cost of Double Patterning Lithography IMEC, in collaboration with JSR Corp. (Tokyo), realized a simplified process using only one etch step to reduce the cost of double patterning ... IMEC June 5, 2008 - Corporate News IMEC and Aixtron Set Important Step Towards Low-Cost GaN Power Devices IMEC and AIXTRON have demonstrated the growth of high-quality and uniform AlGaN/GaN heterostructures on 200mm silicon wafers. This ... IMEC April 28, 2008 - Corporate News IMEC Board reports successful 2007 During today’s General Assembly, the IMEC Board confirmed that 2007 was a successful year with excellent achievements, during which IMEC ... IMEC April 22, 2008 - Corporate News Renesas collaborates with IMEC on reconfigurable RF transceivers Renesas Technology Corp. has entered into a strategic research collaboration with IMEC, Europe's leading independent research center ... IMEC March 18, 2008 - Corporate News IMEC reports methodology to analyze process variability compatible with DFM tools IMEC reports a variability-aware modeling (VAM) flow that analyzes process variability of sub-45nm technologies which enables designers ... IMEC March 13, 2008 - Corporate News IMEC sets first step towards CleanC standardization IMEC introduces a new programming style for C code called CleanC that substantially increases the parallelization and optimization potential ... IMEC To find more corporate news releases from IMEC, use the search form below. NEW Hesse & Knipps BONDJET BJ915L for your leadframe applications Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more… Hesse & Knipps Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. 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