We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 18, 2008 Case Study & Application Note How flat are your substrates? Packaging coplanarity issues begin with the flatness of your substrates. Learn more… Cyber Technologies Counterfeit Components New white paper provides solutions Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Letters Submit Semi Announces That Attendance is Down I was involved in a co-located conference with Semicon West for a number of years, starting out when they had ... Tom Package Science Services Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   Troubled AMD taps new CEO Advanced Micro Devices Inc. said Hector Ruiz, who has led the chip maker's scrappy battle to take market share from market kingpin Intel ... Market Watch Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Semicon West   Final Day Today the show closes. A few things I will remember about this week will be the incredible blues band playing outside the North and West halls, the weather, which has been spectacular and unfortunately what appeared to be the doubling of the homeless community in the last year. The show itself I will remember and mark as the year packaging ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   Chip prices could be going up in 2009 due to capex cutback Semiconductor foundries, which are doing an increasing amount of chip manufacturing, are cutting back on capital expenditures. If they don't ... Purchasing SEMICON West 2008 Day 2: Mobile electronics Mobile electronics and connectivity were key themes addressed by keynote speakers on the second day of SEMICON West 2008. "What's new is that ... CyberMedia India Online Google: Weathering the Economy? The search giant's second-quarter results disappointed investors, but CEO Schmidt believes on-target sales indicate it is shrugging off the ... Business Week 2008 Advanced Packaging Award Winners Announced At SEMICON West Once again, SEMICON West provided the perfect backdrop for Advanced Packaging Magazine to announce the recipients of the 8th annual ... Advanced Packaging Top Semiconductor Suppliers report: Technology is not enough The leading semiconductor suppliers often have cutting-edge technology, but they also meet the cost, quality and delivery requirements of OEMs ... Purchasing Chips fall where they may in the 'More than Moore' era Chip and semiconductor equipment makers are at a crossroads as they face an era that might be called "More than Moore." The relentless pursuit ... EETimes 450-mm debate remains heated Intel, Samsung and TSMC are pushing for 450-mm fabs by 2012 or so. The fab-tool community will hold a panel discussion on 450-mm technology ... EETimes North American chip equipment orders flat in June North American manufacturers of equipment used to make semiconductors reported orders of $1.03 billion in June, flat from the previous ... Reuters No consensus from IC distributors on 2H08 China market outlook The Taiwan Stock Exchange (TSE) yesterday invited Taiwan IC distributors WT Microelectronics and WPG Holdings to share their respective ... DigiTimes IBM, New York State to Invest in Nano-Chip Technologies New York Gov. David A. Paterson on Tuesday announced significant new investments by IBM and New York state, accelerating New York state's ... Government Technology Register today for International Wafer Level Packaging Conference 4 days, 2 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Technology News   Strongest Material Ever Tested Materials scientists have been singing graphene's praises since it was first isolated in 2005. The one-atom-thick sheets of carbon conduct ... MIT Technology Review Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Corporate News Submit DuPont EKC Technology Introduces New EKC162™ Photoresist Remover for Advanced Semiconductor Packaging EKC Technology, part of DuPont Electronic Technologies, will introduce a new photoresist remover for Through Silicon Via (TSV) and Wafer Level ... DuPont Fab Owners Association Membership Surges The Fab Owners Association (FOA) has announced the addition of it newest device-maker members: Infineon Technologies, Maxim Integrated Products ... Fab Owners Association Applied Materials Highlights Technologies Shaping the Future of Computing, Consumer Electronics and Solar At the SEMICON West and InterSolar North America shows being held in this week in San Francisco, Calif., Applied Materials, Inc. showcased ... Applied Materials Asymtek Promotes Roberta Foster-Smith Asymtek announces that it has promoted Roberta Foster-Smith to manager of global marketing communications. Foster-Smith brings over 20 years ... Asymtek Heptagon Micro-Optics Adopts EV Group's IQ Aligner EV Group (EVG) announced that Heptagon Micro-Optics Pte Ltd. in Singapore -- a wholly-owned subsidiary of Finnish-Swiss wafer-scale ... EV Group Eco-SnowT CO2 systems help clean up MEMS sensors Eco-Snow Systems, an affiliate of The Linde Group, has developed automated cleaning technology for the Micro Electrical Mechanical ... Eco-Snow Systems Antares Develops New Chamber-less Room Temperature Burn-In System Antares Advanced Test Technologies have recently examined the effects of chamber-less room temperature burn-in (RTBI) on small-lot ... 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