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  Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
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Photoresist removal technology
WLP Photoresist removalFor Wafer Level Packaging
A new formulation for thick photoresist has been developed to enable high-performance wafer bumping. This paper describes the performance achieved on various wafers. Download this paper now…
DuPont EKC Technology




Semicon Europa:
Where Professionals Define the Industry
Semicon EuropaJoin Semi October 7-9 in Stuttgart Germany for Semicon Europa and learn latest trends and technologies from outstanding programs and visit exhibits by the industries best companies. Learn more…
SEMI
  Industry and Technology News Index
July 21, 2008  -  Click the title to read the full article.

IC makers face "More than Moore" era
The relentless pursuit of scaling over the last 40 years, in accordance with the famed postulate known as Moore's Law, continues to be an ...
EETimes India
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More from EETimes India
October 9, 2008 - Industry News
Stacked microprocessor system promises enhanced performance
Advanced microprocessors do the heavy number-crunching in all sorts of electronics systems, but these chips are hampered by the amount of ...
EETimes India
October 7, 2008 - Industry News
Chip package choices abound
When creating a new IC, all of the initial focus is naturally on the design. When it comes to tape-out, then fabrication, multi-project ...
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October 6, 2008 - Industry News
CMOS is still irreplaceable, says TI exec
Dennis Buss, chief scientist at TI, gave a retrospective look and a prospective analysis of the semiconductor industry as Moore's law is ...
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October 6, 2008 - Industry News
Micron announces cost control measures
Micron Technology Inc. has announced some cost control measures after reporting a Rs.6,881.70 crore ($1.6 billion) loss for its fiscal year ...
EETimes India
October 3, 2008 - Industry News
IBM 'fab club' outlines foundry process roadmap
IBM Corp.'s ''fab club'' alliance has outlined its foundry process roadmap, tipping a 28-nm ''half-node'' technology, and, in some ...
EEtimes India
September 29, 2008 - Industry News
Buzz: Is AMD dropping 'Bobcat' project?
Rumors are running rampant that Advanced Micro Devices Inc. has dropped its "Bobcat" processor project. The processor is expected to compete ...
EETimes India
September 25, 2008 - Technology News
LED lighting breakthrough not before 2012
The energy saving trend has led Aixtron's sales to record heights in Q4/2007. Now the manufacturer of LED production equipment sees a ...
EETimes India
September 25, 2008 - Industry News
Peek inside IBM's 300-mm fab
Up until recently, IBM Corp. and its secretive chip unit refused to reveal any information about its semiconductor operations. The Big Blue did ...
EETimes India
September 23, 2008 - Technology News
Albany NanoTech primes 300-mm R&D fab
Albany NanoTech is opening a massive new operation called NanoFab 300 East, which will focus on 22-nm R&D technology, post-CMOS processes ...
EETimes India
September 22, 2008 - Top Story News
Medical ICs outpace computer, CE markets
The medical semiconductor market is in an early stage of development and still very small compared with the consumer and computer markets. ...
EETimes India
September 8, 2008 - Technology News
Polycrystalline contributes to thin film growth
The global solar cell market will exhibit a remarkable growth—from a market volume of 5.6 GW in 2008 to 79.5 GW in 2015. The market for the ...
EETimes India
September 8, 2008 - Industry News
Printed electronics materials to hit $11B
The market for electronic inks and related substrate materials used in manufacturing printed electronics is expected to reach over Rs.47,144. ...
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August 25, 2008 - Industry News
Wireless JV drives IC consolidation
The consolidation in the semiconductor industry continues—but not necessarily in the exact way many might have expected: The planned ...
EETimes India
August 22, 2008 - Top Story News
IC packaging industry to grow further
The IC packaging industry is expected to grow further as semiconductor outlook is quite positive, reports Electronic Trend Publications (ETP) ...
EETimes India
August 22, 2008 - Industry News
Chips, reference designs not enough to sustain IC cos
Making chips and developing reference designs may no longer be enough to sustain traditional semiconductor companies, especially Application ...
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August 18, 2008 - Technology News
Motorola employs Siimpel's MEMS tech
Siimpel Corp. has announced that its SiimpelFocus SF9x MEMS-based silicon camera technology is in the recently launched Motorola MING A1600 ...
EETimes India
August 8, 2008 - Industry News
Hynix, Numonyx collaborate on NAND
Intel spin-off Numonyx B.V and STMicroelectronics Inc. are teaming up with Korea's Hynix Semiconductor Inc. in a major push in the NAND ...
EETimes India
July 24, 2008 - Top Story News
Expect 10% chip market growth, says Penn
Malcolm Penn, founder and principal analyst with Future Horizons Ltd, believes the market forces are at last moving into place to deliver ...
EETimes India
July 24, 2008 - Industry News
SATS market to beat semiconductor growth
The semiconductor assembly and test services (SATS) market is expected to beat the overall semiconductor industry growth rate for this year, ...
EETimes India
July 23, 2008 - Technology News
Energy applications for nanotech draw interest
The U.S. Department of Energy (DOE) is making new efforts to attract entrepreneurs at early stages to commercialise renewable energy ...
EETimes India
July 21, 2008 - Top Story News
IC makers face "More than Moore" era
The relentless pursuit of scaling over the last 40 years, in accordance with the famed postulate known as Moore's Law, continues to be an ...
EETimes India
July 17, 2008 - Industry News
LSI shifts to implementation mode
Abhi Talwalkar has been a busy guy. In his first 24 months as president and CEO, he was part of five acquisitions, two divestitures, a $3.5 ...
EETimes India
July 15, 2008 - Technology News
Choosing the right package yields tangible benefits
When creating a new integrated circuit, the initial focus is naturally on the design. When it comes to tape-out, then fabrication, multi-project ...
EETimes India
July 7, 2008 - Industry News
More bad news for Nvidia
Nvidia Corp. faces more bad news including product delays, unforeseen price cuts and lost share. On Wednesday (July 2), Nvidia said it ...
EETimes India
July 3, 2008 - Industry News
TI focuses on analogue with new business unit
Texas Instruments Inc. recently formed a new Power Management organisation that is part of its analogue business strategy. This is ...
EETimes India
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Hesse & Knipps BONDJET BJ920
heavy wire bonder integrates pull and shear test
Bond Jet BJ920Hesse & Knipps BONDJET BJ920 heavy wire bonder gives you speed, accuracy and the largest bonding area - it is also the only bonder with integrated pull and shear test. Learn more…
Hesse & Knipps




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