We search for industry news, so you don't need to.   Thursday, Sept 11, Baltimore, MD Asymtek presents free coating and jet dispensing technology workshop including Cyber Technologies, Dow Corning, Dymax, Henkel, Lockheed Martin and HumiSeal discussing latest developments in conformal coating processes, assembly materials and jet dispensing. Reserve your seat now, breakfast & lunch included. Learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Hesse & Knipps PiQC Process Integrated Quality Control Hesse & Knipps NEW, patented PiQC technology targets 100% wire bonding yields, tracking data in real time so you can react quickly to production issues. Learn more… Hesse & Knipps   Industry and Technology News Index July 21, 2008  -  Click the title to read the full article. Malaysia Launches Latest Semiconductor Package Malaysia unveiled a state- of-the-art semiconductor package which is smaller in size yet capable of having a higher capacity. The "QFN 3-D ... Bernama We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Bernama August 19, 2008 - Industry News M'sia Launches Latest Semiconductor Package Malaysia unveiled a state- of-the-art semiconductor package which is smaller in size yet capable of having a higher capacity. The "QFN 3-D ... Bernama July 21, 2008 - Industry News Malaysia Launches Latest Semiconductor Package Malaysia unveiled a state- of-the-art semiconductor package which is smaller in size yet capable of having a higher capacity. The "QFN 3-D ... Bernama November 20, 2007 - Industry News MIMOS To Spur ICT Players To Be Global Competitors MIMOS Bhd, Malaysia's premier ICT (information and communication technology) applied research centre, plans to talk to industry ... Bernama July 20, 2007 - Industry News Fuji To Invest In Malaysia's Semiconductor Industry Fuji Electric (M) Sdn Bhd, a subsidiary of Japan-based Fuji Electric Device Technology Co Ltd, will continue to invest and expand its ... Bernama To find more articles from Bernama, use the search form below. Does your reflow offer guarantees? Ours Does • Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more… ATEK Systems Group Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.