November 20, 2008 - Industry News
MEPTEC Symposium: Density and Cost is Driving Innovation
Speakers at MEPTEC's Packaging Developments and Innovations Symposium, November 13, 2008 in San Jose, CA, presented various new technologies ...
Advanced Packaging
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October 16, 2008 - Industry News
Executive Panel Addresses Options in WLP
While last week's executive panel during SEMICON Europa's Advanced Packaging Conference was intended to focus on WLP and the supply ...
Advanced Packaging
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September 19, 2008 - Technology News
Printed Electronics On a Roll or in a Race?
A recent market forecast predicts a compounded annual growth rate over the next five years of 86% for printed electronics in RF applications ...
Advanced Packaging
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September 18, 2008 - Industry News
X-Ray Inspection Identifies Flip Chip Detects
The basic, straightforward design of a flip-chip device calls for the conductive bumps of the silicon chip to be placed directly on the ...
Advanced Packaging
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September 18, 2008 - Technology News
X-Ray Inspection Identifies Flip Chip Detects
The basic, straightforward design of a flip-chip device calls for the conductive bumps of the silicon chip to be placed directly on the ...
Advanced Packaging
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September 3, 2008 - Industry News
Wafer Level Chip Scale Packaging Forum Present at ESTC
The Wafer Level Chip Scale Packaging (WLCSP) Forum today announced it will participate in the 2nd Electronic System-Integration Technology ...
Advanced Packaging
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July 18, 2008 - Industry News
2008 Advanced Packaging Award Winners Announced At SEMICON West
Once again, SEMICON West provided the perfect backdrop for Advanced Packaging Magazine to announce the recipients of the 8th annual ...
Advanced Packaging
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July 17, 2008 - Technology News
SEMICON West Packaging Summit Address Path to TSV Adoption
In a panel discussion hosted by Bill Bottoms, CEO of Nanonexus, and Jan Vardaman, TechSearch International, Industry experts from IBM, Intel, ...
Advanced Packaging
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July 3, 2008 - Technology News
Amkor Intrduces Novel Flip Chip Technology
Amkor Technology, Inc. announced the introduction of a high-performance flip chip packaging technology using an advanced molding process ...
Advanced Packaging
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July 2, 2008 - Technology News
Carsem's Copper Wirebonding Program in Full Production
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they have been shipping ...
Advanced Packaging
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June 11, 2008 - Industry News
Report: China's IC Market
Research and Markets released an overview of the Chinese market for ICs, with focus on four key emerging markets: Shenzhen, Suzhou, Tianjin, and ...
Advanced Packaging
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June 11, 2008 - Technology News
Replisaurus Unveils "Middle-end-of-Line" Metallization Technology
Just because Replisaurus, Inc. has maintained a low profile since announcing their first round of funding in August 2006 ...
Advanced Packaging
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May 19, 2008 - Industry News
IC Packagers' China Investment Proposals Approved
Taiwan's Ministry of Economic Affairs (MOEA) has approved proposals by IC packaging and testing companies PowerTech Technology Inc., and ...
Advanced Packaging
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May 14, 2008 - Industry News
Rohm and Haas Electronic Materials Wins SSMC's Best Supplier Award for 2007
Rohm and Haas Electronic Materials, CMP Technologies, announced its receipt of Systems on Silicon Manufacturing Company's Best Supplier ...
Advanced Packaging
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May 8, 2008 - Industry News
Flip Chip Goes 3D
Current 3D packaging solutions involve a mix of high density circuit boards with stacked ICs using wire bond interconnect. With advances ...
Advanced Packaging
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April 16, 2008 - Industry News
STMicroelectronics Introduces High-performance MEMS Motion Sensors
STMocroelectronics, a supplier of the MEMS devices found in many gaming and mobile multimedia applications, announced the addition of two ...
Advanced Packaging
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March 20, 2008 - Industry News
Solder Ball Transfer for Flip Chip and WLCSP
Wafer bumping is often separated into two different categories: flip chip bumping and wafer-level chip scale packaging (WLCSP). This ...
Advanced Packaging
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March 6, 2008 - Technology News
3D Packaging Processes — Part III
This article is the third in a series on 3D packaging technology, and summarizes information presented during a January 2008 webcast hosted ...
Advanced Packaging
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March 3, 2008 - Industry News
China Packaging Society President to be Speaker at GBC Conference
The IMAPS Global Business Council (GBC) is pleased to announce that Bi Keyun, PhD and president of the China Electronic Packaging Society, ...
Advanced Packaging
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February 29, 2008 - Industry News
Fundamental Reliability Issues Addressed at Workshop
Members of Unovis Solutions' 2008 Advanced Research in Electronics Assembly Consortium are gathering for the last day of this two-day ...
Advanced Packaging
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February 25, 2008 - Industry News
EV Group Secures Multiple System Order for MEMS-based Motion Sensors
EV Group (EVG) has announced that it has received a multiple system order from Colibrys for one EVG520 semi-automated wafer bonding ...
Advanced Packaging
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February 18, 2008 - Industry News
Yole Releases WLP Report
Yole Developpement has just released a new report entitled "WLP & Embedded Die Technologies 2008". This report presents the ...
Advanced Packaging
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January 31, 2008 - Industry News
MEMS Forecast: Consumer Applications Drive Steady Growth
The latest market research released by Yole Développment forecasts a healthy future for the MEMS market, driven by primarily by consumer ...
Advanced Packaging
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January 22, 2008 - Technology News
Magnum Semiconductor Debuts Multimedia-rich Application Processor
Magnum Semiconductor Corp. announced the ZEVIO ZV1050 Multimedia Application Processor, the latest member of its ZEVIO line of System ...
Advanced Packaging
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January 21, 2008 - Technology News
Silicon Microstructures Strengthens Position in the Medical MEMS Market
Silicon Microstructures, Inc. announced that the company has been selected by OMRON Healthcare, Inc. as a development partner and ...
Advanced Packaging
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