|
|
Semiconductor Packaging News
Advertising delivers!
 Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more...
Semiconductor Packaging News 
Semicon West
Semi Announces That Attendance is Down
 The attendance had appeared light at the SEMICON West show and was confirmed yesterday when SEMI announced that indeed it had dropped 25% the first day. Numbers have not been announced for Tuesday. The mood here remains up beat and the people who have come, seem to be having a good show, with many booking new ...
Steve DeCollibus, Managing Editor
Semiconductor Packaging News
|
ASML warns revenue could fall as much as 20%
ASML Holding, the Dutch chip-equipment maker, warned waning demand could result in as much as a 20% drop in revenue this year. The report ...
Market Watch
|
Gartner says PC sales rose 16% in second quarter
Worldwide personal-computer shipments continued to grow at double-digit rates in the second quarter of the year, but overall revenue is being ...
Market Watch
|
450-mm debate remains heated
The 450-mm debate rages on. The fab-tool community will hold a panel discussion on 450-mm technology. At the Semicon West trade show here ...
EETimes
|
Semi technology, business models converging, IBM’s Meyerson says
Pointing to IBM Corp’s announcement Tuesday afternoon that it will invest $1 billion in its East Fishkill, NY, semiconductor plant over ...
EDN
|
Intersolar Shows PV/Semi Synergies
As photovoltaics (PV) market growth continues to skyrocket, SEMI is furthering its PV initiative at this year’s SEMICON West. In addition ...
Semiconductor International
|
Predictions of a DRAM recovery in 2008 have been overstated, Converge reports
There appears to be turbulence once again in the DRAM market. June was considered a disappointment, with expectations of an increase of more ...
EDN
|
Semitool's Third Quarter Bookings Reach $67.1 Million; Company Achieves Fifth Consecutive Quarter of Order Growth
Semitool, Inc. announced at the SEMICON West trade show that bookings for the third quarter ended June 30, 2008, were $67.1 million, up 33% from ...
CNN Money
|
LSI shifts to implementation mode
Abhi Talwalkar has been a busy guy. In his first 24 months as president and CEO, he was part of five acquisitions, two divestitures, a $3.5 ...
EETimes India
|
Samsung rumors pour cold water on Semicon
Rumors that Samsung Electronics Co. Ltd. this week pushed out its fab-tool orders sent shock waves at the Semicon West trade show here, ...
EETimes
|
Hesse & Knipps PiQC
Process Integrated Quality Control
 Hesse & Knipps NEW, patented PiQC technology targets 100% wire bonding yields, tracking data in real time so you can react quickly to production issues. Learn more…
Hesse & Knipps 
Reducing Test Costs, Throughputs
At yesterday’s Test, Assembly & Packaging TechXPOT’s "Yield Management" session, various presenters demonstrated the necessity of reducing ...
Semiconductor International
|
High-Density Packaging Possibilities
Cellular handsets and mobile handheld products are defining a new application space that goes beyond the realm of traditional ...
Semiconductor International
|
SEMICON West Packaging Summit Address Path to TSV Adoption
In a panel discussion hosted by Bill Bottoms, CEO of Nanonexus, and Jan Vardaman, TechSearch International, Industry experts from IBM, Intel, ...
Advanced Packaging
|
Customized motherboards fit client requirements
Taiwan suppliers of motherboards do not categorize their products by form factors, but by structure or platform. Many companies on the ...
Global Sources
|
Multicore Association Working Group to Develop APIs
The Multicore Association(TM), a global non-profit organization focused on developing standards that help speed time to market for products ...
Chip Design Magazine
|
YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
 YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech 
|
|
|
