Pomona, CA — Everett Charles Technologies (ECT) Contact Products Group (CPG) introduced its revolutionary new line of Pogo contacts for Semiconductor Test at Semicon West in San Francisco. The new Zip™ Family of compliant contacts deploys unique patented designs featuring planar contact surfaces produced by traditional and new innovative test pin manufacturing processes, creating scalable test pitch products that yield optimal performance. The Zip Series is designed to meet today’s demanding test requirements and economics.

The Z Interconnect Pin, “Zip,” is available in three separate design configurations: Radial, Flat, and Hybrid. The Radial Series utilizes traditional machined 3D components; the Flat Series employs innovative 2D components; and the Hybrid combines both technologies, a flat contact for the interface board married with a radial contact for the DUT. With multiple plating options, high-performance, and value pricing, Zip delivers unparalleled flexibility for users.

Bud Fabian, CPG President, commented, “The three Zip Series are designed for interchangeability in the same test tool if desired. They can be mixed and matched in the initial test socket design and built or interchanged later as needed to address specific DUT contact needs or cost objectives. This versatility increases the Zip’s value proposition for our customers.” The Z pin is available today for .5, .8, and 1.0mm test pitches with 1.27, .4, and .3mm designs scheduled for a Q4 release.