We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 16, 2008 Case Study & Application Note How flat are your substrates? Packaging coplanarity issues begin with the flatness of your substrates. Learn more… Cyber Technologies Beat the Counterfeiters New white paper provides solutions Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   Intel defies economic gloom; Q2 profit soars 25% Intel Corp. breezed past analysts' revenue and profit estimates in the recently ended quarter, defying problems in the larger economy to ... EETimes Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Semicon West   Opening Day The show opening today was overshadowed by SEMI’s announcement yesterday that they anticipate that global semiconductor equipment sales will fall 20 % in 2008. The companies we spent time with yesterday seemed to contradict that announcement, they all shared very positive sales so far in 2008, while many were ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   Samsung rumors pour cold water on Semicon Rumors that Samsung Electronics Co. Ltd. this week pushed out its fab-tool orders sent shock waves at the Semicon West trade show here, ... EETimes Henkel Names New Electronics Executive Team Following its acquisition of the Adhesives and Electronics Materials businesses from National Starch and Chemical Company, Henkel named ... Henkel Corporation Industry says no on 450-mm wafer size, but no pushback on Intel I’m starting to wonder what the real story is behind all the talk on the 450-mm wafer size. I’m here at Semicon West in San Francisco this ... EDN IBM to invest $1.5B in nanotechnology IBM will invest $1.5 billion in nanotechnology chip projects, which include a research center in upstate New York at a site yet to be ... EETimes Intersolar: Chip Industry Will Drive Down Solar Costs The solar guru at semiconductor equipment company Applied Materials, Charlie Gay, says the chip companies that drove the electronics ... Earth2Tech SEMI forecasts equipment declines, seeks U.S. policy reforms The industry group SEMI is forecasting that the semicondcutor equipment market will decline 20 percent in 2008. SEMI reported here on Monday ... EETimes Video: Novellus CEO says no to 450-mm At the Semicon West trade show here, Mark LaPedus, semiconductor editor from EE Times, met with Richard Hill, chairman and CEO of Novellus ... EETimes Multicore Association works on resource management standard The Multicore Association, a non-profit organization focused on developing standards for products that involve multicore ... EETimes Novellus Sticks to Its Knitting Yesterday Novellus Systems (NVLS), another leading semiconductor equipment manufacturer for thin film deposition, surface preparation, ... Seeking Alpha Quarter to show if Nokia resilient to downturn Nokia Corp. is expected to report a solid increase in second-quarter operating profit, but investors jilted by Sony Ericsson's recent ... Market Watch Brewer Science Expands Commercialization of Carbon Nanotube Solutions Brewer Science, Inc., a provider of leading-edge materials and processes to the semiconductor industry, announces its expansion into the Roy D. ... Nanowerk LLC Semi ETFs' Fate Lies With the Consumer Semiconductors have been no exception to the general market downturn, but some market experts expect growth to pick up in the next few ... The Street AMD, Nvidia graphics chip designs diverge Nvidia's GTX 280 and GTX 260 are designed to deliver the biggest performance bang per chip. A so-called "monolithic" approach packs ... CNet News Chip equipment market slumps Asian companies will remain the top buyers of chip-making equipment for the foreseeable future despite a slowdown in purchasing, new research ... VNUNet XMOS may make standards unnecessary XMOS Semiconductor, the consumer electronics chip start-up, will take in its first sales revenues this month, and will have its first ... Electronics Weekly Register today for International Wafer Level Packaging Conference 4 days, 2 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Technology News   Handset holds surprise package Japan. The mere mention of the word takes me back to my childhood, when that island nation seemed to be light-years ahead of the West in all ... EETimes Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of ... Centre Daily Times Researchers Generate Hydrogen Without The Carbon Footprint "Other researchers have developed ways to produce hydrogen with mind-boggling efficiency, but their approaches are very high cost," says ... Science Daily PV & Semiconductor Synergy Today marks the beginning of Semicon West 2008, North America’s largest event dedicated to the global semiconductor photovoltaic (PV) and ... Photonics Scientists tweak quantum force, reducing barrier to tiny devices Cymbals don't clash of their own accord - in our world, anyway. But the quantum world is bizarrely different. Two metal plates, placed almost ... Science Centric PV & Semiconductor Synergy Today marks the beginning of Semicon West 2008, North America’s largest event dedicated to the global semiconductor PV and microelectronics ... Photonics Intel Centrino 2 launch was not about the processor There was relatively little said Monday at the Centrino 2 launch about new processors. Almost as little as was said about side shows such as ... CNet News Photoactive grapheme-semiconductor composites The electrical properties of grapheme have been the topic of recent interest from various discipline because this novel carbon material ... Nanowerk LLC Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Corporate News Submit Thin-Film Battery Market Leader Solicore To Present At Semicon West Solicore will be a featured presenter at the SEMICON West 2008 event taking place in San Francisco from July 15 through 17. Jarreth Solomon ... Solicore Machine Vision Products Hires New Sales and Marketing Manager Machine Vision Products announced the appointment of Paul Groome as their sales and marketing manager for Western North American and corporate ... Machine Vision Products Portwell Extends Its Family of Industrial PICMG 1.3 Backplanes American Portwell Technology, Inc. has extended its family of industrial PICMG 1.3 backplanes for PICMG 1.3 system host boards (SHB). The ... American Portwell Technology, Inc. Gore Invests more into the Semiconductor Equipment Industry W. L. Gore & Associates (Gore) has now doubled its manufacturing capacity for flat cables to keep pace with customer demand for cables capable ... W. L. Gore & Associates RF QFN Test Socket From Antares Engineers at Antares Advanced Test Technologies have recently examined the relationship between gold plated spring-probe contactors and ... Antares Advanced Test Technologies Applied Materials Launches Breakthrough E3 Equipment Applied Materials, Inc. announced its Applied E3 advanced equipment and process control solution, a comprehensive factory automation (FA) ... Applied Materials, Inc. Today's Sponsor Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why… Juki Corporation Vapor Phase Soldering White paper Download Wafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more. A-Tek LLC +/- 0.5 micron placement High accuracy prototyping bonder Three bonders in one: Thermo-sonic, thermo-compression, and epoxy attach. Capable of bonding Flip Chip, MEMs, photonics, sensors, WLP, etc. Additional modules for ACF, ACP, and Au bump bonding. Learn more… Finetech Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.