We search for industry news, so you don't need to.   Photo Resist Coating System Featuring Ultrasonic Technology USI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more… Ultrasonic Systems, Inc. Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Heraeus - Celebrating 40 years of USA Manufacturing Excellence Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. While competitors are mainly focusing off shore, Heraeus is committed to serving all markets. Learn more about Heraeus materials… Heraeus, Inc. Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology   Industry and Technology News Index July 17, 2008  -  Click the title to read the full article. More high-tech firms see bright future in solar energy In the past few months, just about every major company in the semiconductor business has joined a rush into the solar industry, ... Atlanta Journal Constitution We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Atlanta Journal Constitution July 17, 2008 - Top Story News More high-tech firms see bright future in solar energy In the past few months, just about every major company in the semiconductor business has joined a rush into the solar industry, ... Atlanta Journal Constitution To find more articles from Atlanta Journal Constitution, use the search form below. Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.