We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Checking for Brittle Fracture Failures? Replace drop testing with high strain rate bondtesting Detecting brittle fracture failures in lead-free materials made easy. The Dage 4000HS high-speed bond tester is the only instrument that assures full compliance with JEDEC standards. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more… Dage Precision Industries   Industry and Technology News Index July 17, 2008  -  Click the title to read the full article. Multicore Association Working Group to Develop APIs The Multicore Association(TM), a global non-profit organization focused on developing standards that help speed time to market for products ... Chip Design Magazine We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Chip Design Magazine October 10, 2008 - Technology News FPGAs with Open System Architecture Drive In-Cabin Automotive Applications The days of horsepower, valves per cylinder and 0 to 60 performance driving mainstream and luxury automotive sales are more or less over. ... Chip Design Magazine July 17, 2008 - Technology News Multicore Association Working Group to Develop APIs The Multicore Association(TM), a global non-profit organization focused on developing standards that help speed time to market for products ... Chip Design Magazine July 14, 2008 - Industry News Hermes Die Consortia Selects FlipChip EDC Technology Hermes, the European consortia for the development and industrialization of embedded die technology has announced FlipChip International, ... Chip Design Magazine June 5, 2008 - Technology News It’s Time to Make Noise about Co-design -- Got Package? Over the past year, I’ve had the pleasure of meeting with design teams from many of the leading semiconductor companies from around the ... Chip Design Magazine May 29, 2008 - Technology News Getting Practical about Semiconductor IP Reuse Mark Twain had a saying that "Everyone complains about the weather but no one does anything about it." IP reuse seems to have fallen in the ... Chip Design Magazine May 23, 2008 - Top Story News A Ticking Time Bomb? Power is a hot problem these days, no pun intended. To address the escalating power challenges, many companies have adopted multi- ... Chip Design Magazine May 20, 2008 - Technology News Altera Announces 40-nm FPGAs and HardCopy ASICs Enabling designers to achieve new levels of integration and innovation, Altera Corporation announced the industry’s first 40-nm FPGAs and ... Chip Design Magazine April 9, 2008 - Technology News AMCC to Demonstrate Embedded Power Architecture Applied Micro Circuits Corporation announced that it will team with customers and partners to showcase advanced solutions of its line of ... Chip Design Magazine January 18, 2008 - Technology News Measurement Innovations Mean Big Savings for Semiconductors A new report from the National Institute of Standards and Technology (NIST) shows that investment in measurement science has and will ... Chip Design Magazine December 18, 2007 - Industry News Evironmental Kudos for Taiwanese Semiconductor Company UMC (NYSE: UMC), a leading global leading semiconductor foundry, has been ranked as the top semiconductor company in Taiwan in the Clean ... Chip Design Magazine August 27, 2007 - Technology News Creating an ESL Flow Designing with register transfer level (RTL) code has a well-established ecosystem and methodology. Within this methodology are various ... Chip Design Magazine August 6, 2007 - Technology News Chip Designers Must Think Like an Architect for Chip-Package Co-Design Despite warnings of dire consequences and tales of chips not fitting their packages, not nearly enough attention has been paid to IC ... Chip Design Magazine August 6, 2007 - Technology News DFM Integrated into 65nm Lithography Simulation and Analysis Blaze DFM, the electrical DFM company, has been chosen by the Semiconductor Technology Academic Research Center (STARC) to provide ... Chip Design Magazine July 11, 2007 - Industry News Companies to Address Datalog Bottleneck in Yield Analysis The STDF Fail Data Standardization Group is holding an open meeting at SEMICON West on July 17 to review progress on the working group's ... Chip Design Magazine July 5, 2007 - Technology News DDR IP Integration: How to Avoid Landmines in this Quickly Changing Landscape In just a few short years, the double-data-rate (DDR) intellectualproperty (IP) market has become very unfamiliar to the ... Chip Design Magazine June 27, 2007 - Technology News Nanotubes Nurture Next-Generation Semiconductor Devices Nantero, Inc., a nanotechnology company using carbon nanotubes for the development of next-generation semiconductor devices, has provided ... Chip Design Magazine May 31, 2007 - Technology News Industry Fab Group Grows The Fab Owners Association (FOA), the association of semiconductor / MEMS manufacturing executives and suppliers, has announced the ... Chip Design Magazine May 15, 2007 - Technology News Methodology Kit Speeds Adoption of Low-Power Designs Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic-design innovation, today announced the industry's first ... Chip Design Magazine May 14, 2007 - Technology News Automated Material Handling System Eliminates Fab Delays Aquest Systems, which is developing innovative automation solutions, today unveiled FabEX™, a new type of automated material handling ... Chip Design Magazine To find more articles from Chip Design Magazine, use the search form below. White Paper: Photo Resist coating Precision coating with Ultraspray Technology Outlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper… Ultrasonic Systems, Inc. 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