We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers July 15, 2008 Case Study & Application Note How flat are your substrates? Packaging coplanarity issues begin with the flatness of your substrates. Learn more… Cyber Technologies Beat the Counterfeiters New white paper provides solutions Success begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper… Dage Precision Industries Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   Equipment Sales Will Fall 20% in 2008: Rebound of 13% Forecasted Next Year SEMI anticipates global semiconductor equipment sales of $34 billion this year, down 20 percent from $43 billion in 2007, according to the 2008 ... SEMI Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Exclusive   New Enabling Micro and NanoMetallization Process Shows Promise ECPR™ (ElectroChemical Pattern Replication) is a technology most of us haven’t heard of, yet it may well prove to be the enabling technology of choice for fabrication of micro- and nano-scale metal layers, and a process that when launched will give manufacturers of advanced packaging, substrates, ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   Gartner upgrades Si wafer demand outlook Market research group Gartner is predicting that wafer demand will improve this year, revising marginally upwards a previous forecast ... Electronics Supply & Manufacturing Amkor Unveils High-Performance Flip-Chip Packaging Technology Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. ... Semiconductor International Chip R&D on its last legs? Intermolecular Inc. and Semiconductor Research Corp. are expected to roll new R&D initiatives at this week's Semicon West show here, with ... EETimes Philips Posts 54% Drop In Q2 Net Royal Philips Electronics NV reported Monday that its second-quarter net income dropped 54 percent to $1.14 billion, from $2.5 billion a year ... Twice IMEC, Qualcomm to research 3D integration To understand and develop solutions for the use of 3D technologies in future wireless products, Leuven, Belgium-based nanoelectronics ... EDN Thin-film solar cells heading for $1 per Wp Thin-film solar cells are cheaper than traditional solar panels, such as those made of polycrystalline silicon, but the yield is lower. However ... Glass on Web Novellus Systems posts $2.4M loss for 2nd quarter A sharp drop in sales and a series of charges pushed chip equipment maker Novellus Systems Inc. to a loss for the second quarter. The San Jose ... Forbes AMD faces $948M in Q2 charges on layoffs, ATI deal As its stock continued to get slammed, Advanced Micro Devices Inc today announced nearly $1 billion in various Q2 charges related to the ... EDN Semiconductor sales may escape harsh economy's impact Gartner Inc’s optimism toward the semiconductor market continues to grow, as the market research company today said the industry will record Q2 ... EDN Apple shuns leading chip makers in 3G iPhone Following the trend it set with its original iPhone, Apple has shunned top-tier chip makers for many of the major sockets its latest model ... EETimes Endicott Interconnect's 6 years at Endicott facility prove critics wrong It's been rough at times for Endicott Interconnect Technologies, a company that's fought hard to differentiate itself from IBM and ... Press & Sun-Bulletin Myths about the death of the American factory Sure, US banking is in trouble, but the longer-term and possibly more damaging threat to the nation’s prosperity is the decline of the ... The Peninsula Healthcare, next frontier for semiconductors Freescale Semiconductor, a prominent face in the silicon world, is a $6-billion company based in Austin, Texas. It employs around 24,000 ... Economic Times Sand 9 Gets $8M for Nano MEMs Sand 9, a Boston University spinoff, has received $8 million in a Series A round from Flybridge Capital Partners and General Catalyst Partners. ... Giga Omni Media Register today for International Wafer Level Packaging Conference 4 days, 2 tracks, keynote dinners, special business and technical panels, professional workshops, exhibits, poster sessions. If its about any significant new or current IC packaging method, you'll find it here! SMTA Technology News   Choosing the right package yields tangible benefits When creating a new integrated circuit, the initial focus is naturally on the design. When it comes to tape-out, then fabrication, multi-project ... EETimes India Gigabyte pushes into mid-range motherboard market, says paper In order to prevent head-on competition with Asustek Computer, Gigabyte Technology has decided to fully push into the mid-range market this ... Digitimes Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Corporate News Submit Dupont Performance Elastomers To Introduce Kalrez® 8900 Parts DuPont Performance Elastomers will introduce Kalrez® 8900 perfluoroelastomer parts specifically designed for semiconductor thermal ... Dupont Applied Materials Highlights Technologies Shaping the Future of Computing, Consumer Electronics and Solar At the SEMICON West and InterSolar North America shows being held in this week in San Francisco, Calif., from July 15-17, Applied Materials, Inc. ... Applied Materials Fab Owners Association To Host Device-Maker Forum At Semicon West The Fab Owners Association (FOA) will host a forum at Semicon West (www.semi.org) on Thursday, July 17. Structured as part of the FOA's ... Fab Owners Association Samsung MLC-based 128GB SSD is Now in Volume Production Samsung Electronics Co., Ltd. announced that it has begun mass producing 1.8- and 2.5-inch multi-level cell (MLC)-based solid state drives ... Samsung Electronics Co., Ltd. Chipworks Senior Technical Advisor Invited to Present at SEMICON West Dick James discusses different transistor structures during the evolution of 65-nm technology, and examines the first 45-nm parts introduced in ... Chipworks Machine Vision Products Promotes North American Sales Manager Machine Vision Products announced the promotion of Richard Osborne as their North American Sales Manager. This promotion is the result of ... Machine Vision Products ISE Labs Adds Verigys Inovys FaultInsyte Software Verigy announced that ISE Labs has purchased the revolutionary Inovys FaultInsyte software. Adding FaultInsyte software has increased ISE ... Verigy Moncada Enters Solar Energy Market with Contract for Applied Materials The Moncada Energy Group s.r.l. has awarded Applied Materials, Inc. a contract to establish what will be Moncada’s first photovoltaic (PV) ... Applied Materials Today's Sponsor Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why… Juki Corporation Vapor Phase Soldering White paper Download Wafer bumping and package attach becomes more complex with lead free alloys. Vapor Phase provides an Oxygen free, 0 deg delta T alternative to conventional thermal systems. Download this white paper to learn more. A-Tek LLC +/- 0.5 micron placement High accuracy prototyping bonder Three bonders in one: Thermo-sonic, thermo-compression, and epoxy attach. Capable of bonding Flip Chip, MEMs, photonics, sensors, WLP, etc. Additional modules for ACF, ACP, and Au bump bonding. Learn more… Finetech Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.