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  Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Asymtek
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Case Study & Application Note
Measure solder bump coplanarity
Solder Bump Case Study Does your Bumping Process Maintain the Same Plane? Ensuring the height and coplanarity of conductive bumps improves yields. Learn more...
Cyber Technologies




Die attach and flip chip placement
CX SeriesThe Juki CX Series
The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why…
Juki Corporation
  Industry and Technology News Index
July 16, 2008  -  Click the title to read the full article.

Intersolar: Chip Industry Will Drive Down Solar Costs
The solar guru at semiconductor equipment company Applied Materials, Charlie Gay, says the chip companies that drove the electronics ...
Earth2Tech
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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech




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