We search for industry news, so you don't need to.
  Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Asymtek
Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers

Case Study & Application Note
Measure solder bump coplanarity
Solder Bump Case Study Does your Bumping Process Maintain the Same Plane? Ensuring the height and coplanarity of conductive bumps improves yields. Learn more...
Cyber Technologies




High-Speed Stamp Soldering
New white paper
Stamp Soldering White PaperThis paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more…
Juki Corporation
  Corporate News Index
July 17, 2008

Chipworks New ICInside Surveyor™

Putting a Virtual SEM on Your Desktop, Accelerating the Use of Reverse Engineering in Forward Designs

ICInside Surveyor™ is the world’s first tool that allows MEMS, Architects and IC Designers to quickly analyze thousands of high magnification images on their desktop

Ottawa, Ontario – Chipworks, the leader in reverse engineering and technical analysis of semiconductors and microelectronic systems, today announced ICInsider Surveyor™, a powerful tool that delivers thousands of extremely high magnification design images directly from Chipworks’ labs to design engineers’ desktops. Chipworks will be demonstrating the ICInside Surveyor™ during select appointments at Semicon West in San Francisco, July 15 – 17.

“This new capability puts a virtual scanning electron microscope (SEM) on our clients’ desktops, giving them the ability to measure, label, and study the layers of a fully imaged device at extremely high magnification,” says Julia Elvidge, President of Chipworks. “Our clients benefit by being able to examine every single nanometer across all interconnect layers of the hottest new device, or the structural details of an innovative new MEMS chip.”

Developed in tandem with our clients, the ICInside Surveyor™ significantly reduces the time required to analyze competitive devices and integrate that analysis into product designs, resulting in lower development costs, faster time-to-market and more socket wins.

The ICInside Surveyor™ dramatically speeds delivery of world class reverse engineering analysis that is timely and accurate, allowing design engineers to rapidly understand and realize value from reverse engineering in forward design. The innovative application is a robust way to explore competitive designs and identify areas for die shrinkage, circuit extraction, and layout organization (e.g. ESD structures). For MEMS Architects, it also provides “Infinite Measurability” for building accurate simulations.

ICInside Surveyor™ is now available with seven reports on MEMS devices including:

  • Analog Devices ADXL330............ 3-axis accelerometer
  • Bosch SMB380......................... 3-axis accelerometer
  • Bosch SMG070......................... gyroscope
  • Freescale MMA7260Q................ 3-axis accelerometer
  • Kionix KXM52........................... 3-axis accelerometer
  • SiTime SiT8002 ....................... oscillator
  • STMicroelectronics LIS302DL...... 3-axis accelerometer

Additional reports will be available on an ongoing basis, and clients can request a custom analysis at any time.

Contact:
Chipworks


http://www.chipworks.com

This page has been viewed 52 times.
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.


Let us do the searching for you.

Get a Free Subscription to Semiconductor Packaging News

More from Chipworks
November 19, 2008 - Corporate News
TSV Report – Toshiba VGA CMOS Image Sensor
Chipworks Inc. and Yole Developpement announced that they have combined their analysis to release an exclusive joint report on Toshiba's ...
Chipworks Inc.
September 16, 2008 - Corporate News
Chipworks Analyzes the First Proven Commercial Implementation of TSV Technology
Chipworks announced the availability of a full reverse engineering report on Toshiba's Through Silicon Via (TSV) technology. The analyzed device ...
Chipworks
July 17, 2008 - Corporate News
Chipworks New ICInside Surveyor™
Chipworks announced ICInsider Surveyor™, a powerful tool that delivers thousands of extremely high magnification design images directly from ...
Chipworks
July 15, 2008 - Corporate News
Chipworks Senior Technical Advisor Invited to Present at SEMICON West
Dick James discusses different transistor structures during the evolution of 65-nm technology, and examines the first 45-nm parts introduced in ...
Chipworks
To find more corporate news releases from Chipworks, use the search form below.


YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech




Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News
Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA
Copyright © 2008 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.