We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Cyber Technologies is leader in laser-based, high-resolution 3D inspection for microelectronics Our world-class clients rely on our CyberScan Vantage Systems for inspection of: Substrate Flatness, Bump and Ball Coplanarity, Wire Bond Loop Height, Film and Paste Thickness & Volume and Transparent Materials Deposition. Learn more... Cyber Technologies   Industry and Technology News Index July 15, 2008  -  Click the title to read the full article. Equipment Sales Will Fall 20% in 2008: Rebound of 13% Forecasted Next Year SEMI anticipates global semiconductor equipment sales of $34 billion this year, down 20 percent from $43 billion in 2007, according to the 2008 ... SEMI We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from SEMI December 2, 2008 - Industry News October Semiconductor Sales Decline 2.4% Year-on-Year Worldwide sales of semiconductors declined by 2.4% in October to $22.5 billion compared to sales of $23.0 billion in October 2007, the ... Semiconductor Industry Association December 2, 2008 - Technology News Applied Announces TSV Etcher, In-Fab Mask Inspection Capability In twin announcements today, Applied Materials Inc.announced an etch system aimed at through-silicon via (TSV) applications. Also, Applied ... Semiconductor International December 1, 2008 - Industry News Jonathan Davis Named President of SEMI North America SEMI announced the appointment of Jonathan Davis to the position of president of SEMI North America effective January 1, 2009. Davis ... SEMI November 24, 2008 - Technology News ST joins MIT, ultra-low-power MCU devices group STMicroelectronics announced it has joined the Microsystems Industrial Group (MIG) industry consortium at the Microsystems Technology Labs ... Semiconductor International November 21, 2008 - Industry News SIA Forecast: 2009 Down Almost 6% Although visibility is limited by current questions about consumer confidence, the Semiconductor Industry Association announced its ... Semiconductor International November 21, 2008 - Top Story News Industry Downturn No. 11 Won't Be as Bad as No. 10 Just as people can't help but compare the current global economic recession to the Great Depression, reviewing the semiconductor ... Semiconductor International November 20, 2008 - Exclusive Articles/Announcements TechnologyWorld08 Monday November 17 was the first of the two day UK Trade & Investment TechnologyWorld08 event, held at the impressive Ricoh Arena, Coventry, UK. This large soccer complex, with ideal business facilities is the home of Coventry City, in ... Semiconductor Packaging News November 20, 2008 - Industry News 3-D, TSV Need Standards and Thermal Solutions to Advance Tuesday sessions at the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., indicate ... Semiconductor International November 19, 2008 - Industry News North American Semiconductor Equipment Industry Posts October 2008 Book-to-Bill Ratio of 0.93 North America-based manufacturers of semiconductor equipment posted $843 million in orders in October 2008 (three-month average basis) and a ... Semi November 19, 2008 - Top Story News 3-D Integration Lacking in Design and Test Support At a symposium leading up to the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., ... Semiconductor International November 19, 2008 - Technology News Fujitsu Microelectronics Provides Advanced 65nm RF CMOS Process Design Kit Fujitsu Microelectronics America, Inc. (FMA) recently announced the availability of 65nm RF CMOS manufacturing services with the ... Semiconductor Online November 18, 2008 - Technology News 3-D Integration Development Threatened by Economic Uncertainty As presenters and attendees prepare for the opening of this year's 3-D Architectures for Semiconductor Integration and Packaging conference, ... Semiconductor International November 17, 2008 - Corporate News All American Semiconductor® Opens New Power Conversion Solutions Center All American Semiconductor® announces the opening of its new Power Conversion Solutions Center (PCSC). The PCSC is U/L and TUV safety ... All American Semiconductor November 17, 2008 - Corporate News Precision Automotive Forward Lighting With its integrated shutter, the new OSTAR Headlamp LED from OSRAM Opto Semiconductors will simplify automotive headlamp optical systems by ... OSRAM Opto Semiconductors November 14, 2008 - Industry News Silicon Wafer Shipments Contract in Third Quarter 2008 Worldwide silicon wafer area shipments contracted almost three percent during the third quarter of 2008 when compared to the second quarter ... Semiconductor International November 13, 2008 - Corporate News New Ceramos and Oslux Leds for Flash Photography Provide Great Pictures In Any Light The new generation of CERAMOS and OSLUX LED flash products from OSRAM Opto Semiconductors are twice as bright as their predecessors ... OSRAM OPTO Semiconductors November 12, 2008 - Technology News Touch Panel Displays Gain Reliability Touch panel displays with improved reliability and endurance emerged at the FPD International 2008 show, held recently in Yokohama, Japan ... Semiconductor International November 12, 2008 - Technology News National Semiconductor Introduces Industry's Highest-Performance, 10-Bit, 1 GSPS Signal Path Solution National Semiconductor Corp. recently introduced a 2.5 GHz fully differential amplifier and a 10-bit, 2 Giga-sample per second single/1 ... Semiconductor Online November 11, 2008 - Corporate News Pericom Announces Low-Power M-Series Spread-Spectrum Crystal Oscillator Pericom Semiconductor Corporation announced the M-Series Spread Spectrum Crystal Oscillator offering customers both very low power ... Pericom Semiconductor Corporation November 11, 2008 - Industry News IBM Offers 45 nm SOI Foundry Offering IBM Corp. said it is offering a 45 nm silicon on insulator (SOI) technology to foundry customers, including SOI-aware standard cell libraries from ... Semiconductor International November 7, 2008 - Industry News China’s Chip Industry Facing Challenges China's semiconductor industry has reached a plateau, with local design houses finding it hard to reach the critical mass enjoyed by U.S. ... Semiconductor International November 6, 2008 - Industry News IC Industry Entering ‘Capitulation Mode’ The semiconductor industry is cutting back investments, engaging in what Bill McClean, president of IC Insights, called "capitulation mode," ... Semiconductor International November 6, 2008 - Exclusive Articles/Announcements iMAPS The keynote today given by Donald Carcieri, Governor of Rhode Island, stressed a need for both industry and government to focus on science and math in schools and universities. Like many of the members of ... Semiconductor Packaging News November 5, 2008 - Exclusive Articles/Announcements iMAPS International Symposium in Full Swing The iMAPS 41st International Symposium on Microelectronicsgot under way yesterday at 11:00 AM, with the opening of exhibits, the annual general business meeting and a very interesting keynote given by Dr. John C. Zolper, Vice President of Corporate Research & Development at ... Semiconductor Packaging News To find more articles from SEMI, use the search form below. High-Speed Stamp Soldering New white paper This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more… Juki Corporation Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.