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July 14, 2008


YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
imageYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech

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Case Study & Application Note
How flat are your substrates?
image Packaging coplanarity issues begin with the flatness of your substrates. Learn more...
Cyber Technologies
Letters Submit

Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
imageHeraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials…
Heraeus, Inc.
Top Story  
iNEMI Recommendations for Managing Lead-Free Solder Alloys
There are serious challenges associated with managing multiple lead-free solder alloys — in terms of both manufacturing and product ...
Semiconductor International

Tested & Proven WLP Resist Removal by EKC
imageFast, Low Temp, Won't Attack Metals
Formulated to enhance the removal of resists cleanly and efficiently, with full dissolution, preventing redeposition, while minimizing damage to metal conductors, bumps and RDL dielectrics. Specially formulated for WLP applications. Learn more…
DuPont EKC Technology
Industry News  
KLA-Tencor and the Fate of the Semiconductor Capital Equipment Sector
KLA-Tencor (KLAC) is the world leader in yield management and process control solutions for semiconductor manufacturing and related ...
Seeking Alpha
Hermes Die Consortia Selects FlipChip EDC Technology
Hermes, the European consortia for the development and industrialization of embedded die technology has announced FlipChip International, ...
Chip Design Magazine
MEMS Industry Group Provides Member News Snapshot on Eve of SEMICON West
MEMS Industry Group (MIG), the unifying voice of the commercial microelectromechanical systems (MEMS) community, today provided a ...
Market Wire
VITA warns of confused board industry, destabilized chip industry
VITA has published a special addendum to its 2008 State of the VME Industry white paper, warning of destabilizing trends in the ...
EETimes
Solar cell production to benefit chemical, material suppliers
Consumption of chemicals and materials for amorphous silicon solar cell production is expected to reach $240 million in 2008 and $575 million ...
EETimes
Analog Rising
A year ago, I would not have recommended shares of Norwood, Mass.-based Analog Devices. The company was struggling. From 2004 to 2007 ...
Forbes
New Packaging Technologies Dominate Best of West Awards
Underscoring the degree of innovation occurring in semiconductor packaging, four of the eight finalists in the SEMI Best of West awards ...
Semiconductor International
Semiconductor companies making move into solar-power industry
Semiconductor companies, which made computers and other electronic devices ubiquitous, now are setting their sights on solar power ...
Palm Beach Post
Amkor Tech shares plunge on 2Q sales outlook cut
Shares of Amkor Technology Inc. fell sharply Friday after the chip packaging and testing services company reduced its second-quarter ...
Forbes
Even More ATI Woes for AMD
Advanced Micro Devices Inc.'s (AMD) 2006 acquisition of graphics chipmaker ATI Technologies Inc. has once again forced the processor ...
Seeking Alpha
Samsung MLC-based 128GB in production
Samsung Electronics Co. Ltd has begun mass production of 1.8- and 2.5-inch multi-level cell (MLC)-based solid state drives (SSD) with a 128 ...
CyberMedia India Online
Micron stock hits 14-year low, rebounds slightly
Micron Technology stock sank to its lowest price in 14 years Friday on the New York Stock Exchange. The company’s stock fell to $5.21 a share ...
Idaho Statesman
Silicon Genesis Enters the Solar PV Market with Revolutionary Wafering Technology
Silicon Genesis, a leader in process and technology for engineered substrates announced today that it has successfully produced solar ...
Market Watch

Improve Your Uptime
High Precision Dispense Tips
imageThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
Technology News  
Shrinking chip could keep us on track with Moore's law
Silicon chips could become even more densely packed with transistors thanks to a breakthrough that carves features in silicon that are ...
New Scientist
Nanotubes could aid semiconductor industry
Two Stanford University engineers have developed a nanotechnology that could be used to mass-produce semiconductors that are much faster than ...
Leader-Telegram
Scientists Pave Way For 25nm CPUs
arcticstoat writes in with word that scientists at the Space Nanotechnology Laboratory at MIT have found a new way of extending ...
Slashdot
Most CF Cards Fail DMA Transfers
"In his quest to create an open source video camera, Andrey Filippov of elphel.com has determined that most Compact Flash devices, although ...
Slashdot
Converter ICs Eliminate Secondary Feedback
Reducing Power Supply Component Count by 30%, Power Integrations' LinkSwitch II Series AC/DC switched-mode power conversion ICs ...
ECN Magazine
Innovation fuels solar power drive
Solar power, which has been the next big thing on the energy horizon for decades, may finally be reaching a tipping point. Long considered far ...
Boston Globe
Researchers enhance lithography light sources
A breakthrough discovery at UC San Diego may help aid the semiconductor industry's quest to squeeze more information on chips to accelerate ...
Science Centric

New Photovoltaic Coating System
Precision coating of solar wafers
imageTo apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more…
Ultrasonic Systems, Inc.

Corporate News Submit
SUSS MicroTec Delivers Coat/Develop Cluster to Replisaurus Technologies
SUSS MicroTec announced that it has shipped and successfully installed a Gamma coating cluster at Replisaurus Technologies, a provider of a ...
SUSS MicroTec
Spreadtrum Shifts to Verigy Port Scale RF Solution for Testing Wireless Devices
Verigy announced that Spreadtrum Communications, Inc. has selected the Verigy Port Scale RF solution for production testing of its devices in ...
Verigy
BI Technologies Expands Hybrid Microcircuit Capabilities
TT electronics BI Technologies has expanded its hybrid microcircuit capabilities by hermetically packaging industry standard die and up ...
BI Technologies
KLA-Tencor Launches First Computational Lithography Tool
KLA-Tencor introduced the latest version of its industry-leading computational lithography tool, PROLITH 11. The new tool enables users ...
KLA-Tencor
Labtech Microwave Reports On Excellent MTT-S/IMS Show
Labtech Microwave has reported a successful MTT-S/IMS show 2008. Held in Atlanta, Georgia, USA from 15 – 20 June the Microwave Theory and ...
Labtech Microwave
R&D Circuits acquires Anestel
James V. Russell, President of R&D Circuits and Darren Young, CEO of Anestel announces the merger of Anestel Corporation by R&D Circuits ...
R&D Circuits
Today's Sponsor

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The $10 counterfeit component
imageSuccess begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper…
Dage Precision IndustriesAdvertisement

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Semiconductor Packaging News
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Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more...
Semiconductor Packaging News

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Hesse & Knipps BONDJET BJ920
heavy wire bonder integrates pull and shear test
imageHesse & Knipps BONDJET BJ920 heavy wire bonder gives you speed, accuracy and the largest bonding area - it is also the only bonder with integrated pull and shear test. Learn more…
Hesse & Knipps


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