We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Solar wafer coating - White paper USI has developed Nozzle-less Ultrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more… Ultrasonic Systems, Inc. Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek   Industry and Technology News Index July 14, 2008  -  Click the title to read the full article. Converter ICs Eliminate Secondary Feedback Reducing Power Supply Component Count by 30%, Power Integrations' LinkSwitch II Series AC/DC switched-mode power conversion ICs ... ECN Magazine We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from ECN Magazine November 25, 2008 - Technology News S-Band VCO Operates to 2,450 MHz Offering a tuning voltage range from 0.50 VDC to 4.50 VDC, Z-Communications' V804ME14-LF S-band VCO performs from 2,300 MHz to ... ECN Magazine November 21, 2008 - Technology News Transistors Demonstrate Low VCE(SAT) Coming in a SMT SOT-883L TLP leadless package, Central Semiconductor’s CET3904E (NPN) and CET3906E (PNP) 40-V general-purpose transistors ... ECN Magazine October 28, 2008 - Technology News DC/DC Converters Produce 1 A Output Current Providing regulated output voltages from 3.30 VDC to 12 VDC, Aimtec’s AMSR1-78-NZ Series non-isolated DC/DC switching regulator converters ... ECN Magazine October 24, 2008 - Technology News GPS Chip Antenna Exhibits Small Footprint Having a ground clearance area of 4 mm × 4.250 mm, Pulse’s W3011 SMT ceramic GPS chip antenna measures 1.600 mm × 3.200 mm × 1.100 mm ... ECN Magazine September 24, 2008 - Technology News Recovery Rectifier Yields High Switching Speed Coming in the GPR-4AM voidless glass-bead axial-leaded case, Central Semiconductor’s CPR5U-040 5 A 400 V recovery rectifier exhibits a ... ECN Magazine September 19, 2008 - Technology News Voltage Translator Yields Wide Voltage Range Performing in Bluetooth and display screens, Fairchild Semiconductor’s FXM2IC102 I²C voltage translator operates over a voltage range from ... ECN Magazine September 16, 2008 - Technology News Power Resistors Exhibit High Tolerances Possessing a temperature coefficient of resistance or 25 or 50 ppm, Thin Film Technology’s line of chip power resistors present resistance ... ECN Magazine September 16, 2008 - Technology News Linear Positioning Stage Offers Micron Bidirectional Repeatability Featuring micron bidirectional repeatability, the SMS 12 positioning stage from Equipment Solutions, combines a cross roller bearing stage ... ECN Magazine August 27, 2008 - Technology News Evaluation Platform Enables Prototyping Allowing DSP or processor aggregation, Tundra Semiconductor’s Tsi620 multi-standard RapidIO switch evaluation platform enables prototyping ... ECN Magazine July 14, 2008 - Technology News Converter ICs Eliminate Secondary Feedback Reducing Power Supply Component Count by 30%, Power Integrations' LinkSwitch II Series AC/DC switched-mode power conversion ICs ... ECN Magazine June 17, 2008 - Industry News FlipChip Partners with Unisem in Wafer Bumping, Wafer Level Packaging Unisem Berhad and its subsidiary Unisem-Advanpack Technologies Sdn Bhd have entered into an agreement with FlipChip International, LLC (FCI) ... ECN Magazine June 13, 2008 - Technology News MEMS Sensor Provides 3D Orientation Info Consolidating multiple sensor functions in a single 14-pin LGA ECOPACK SMT package, STMicroelectronics’ FC30 sensor provides 3D orientation ... ECN Magazine To find more articles from ECN Magazine, use the search form below. Case Study & Application Note Measure transparent materials Control the height and volume of your clear flux, epoxy or adhesive deposits with sub-micron precision. Learn more... 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