We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Heraeus - Celebrating 40 years of USA Manufacturing Excellence Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials… Heraeus, Inc. White Paper: Photo Resist coating Precision coating with Ultraspray Technology Outlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper… Ultrasonic Systems, Inc.   Industry and Technology News Index July 14, 2008  -  Click the title to read the full article. New Packaging Technologies Dominate Best of West Awards Underscoring the degree of innovation occurring in semiconductor packaging, four of the eight finalists in the SEMI Best of West awards ... Semiconductor International We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Semiconductor International December 2, 2008 - Technology News Applied Announces TSV Etcher, In-Fab Mask Inspection Capability In twin announcements today, Applied Materials Inc.announced an etch system aimed at through-silicon via (TSV) applications. Also, Applied ... Semiconductor International November 24, 2008 - Technology News ST joins MIT, ultra-low-power MCU devices group STMicroelectronics announced it has joined the Microsystems Industrial Group (MIG) industry consortium at the Microsystems Technology Labs ... Semiconductor International November 21, 2008 - Industry News SIA Forecast: 2009 Down Almost 6% Although visibility is limited by current questions about consumer confidence, the Semiconductor Industry Association announced its ... Semiconductor International November 21, 2008 - Top Story News Industry Downturn No. 11 Won't Be as Bad as No. 10 Just as people can't help but compare the current global economic recession to the Great Depression, reviewing the semiconductor ... Semiconductor International November 20, 2008 - Industry News 3-D, TSV Need Standards and Thermal Solutions to Advance Tuesday sessions at the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., indicate ... Semiconductor International November 19, 2008 - Top Story News 3-D Integration Lacking in Design and Test Support At a symposium leading up to the 3-D Architectures for Semiconductor Integration and Packaging conference this week in Burlingame, Calif., ... Semiconductor International November 18, 2008 - Technology News 3-D Integration Development Threatened by Economic Uncertainty As presenters and attendees prepare for the opening of this year's 3-D Architectures for Semiconductor Integration and Packaging conference, ... Semiconductor International November 14, 2008 - Industry News Silicon Wafer Shipments Contract in Third Quarter 2008 Worldwide silicon wafer area shipments contracted almost three percent during the third quarter of 2008 when compared to the second quarter ... Semiconductor International November 12, 2008 - Technology News Touch Panel Displays Gain Reliability Touch panel displays with improved reliability and endurance emerged at the FPD International 2008 show, held recently in Yokohama, Japan ... Semiconductor International November 11, 2008 - Industry News IBM Offers 45 nm SOI Foundry Offering IBM Corp. said it is offering a 45 nm silicon on insulator (SOI) technology to foundry customers, including SOI-aware standard cell libraries from ... Semiconductor International November 7, 2008 - Industry News China’s Chip Industry Facing Challenges China's semiconductor industry has reached a plateau, with local design houses finding it hard to reach the critical mass enjoyed by U.S. ... Semiconductor International November 6, 2008 - Industry News IC Industry Entering ‘Capitulation Mode’ The semiconductor industry is cutting back investments, engaging in what Bill McClean, president of IC Insights, called "capitulation mode," ... Semiconductor International November 5, 2008 - Technology News TMV: An ‘Enabling’ Technology for Next-Gen PoP Requirements Demand for package-on-package (PoP) is still rising, thanks in large part to wildly popular smartphones like Apple’s (Cupertino, Calif.) iPhone ... Semiconductor International November 4, 2008 - Industry News MEMC Electronic chief has resigned Nabeel Gareeb, President and CEO for 6 years was the area's highest-paid executive in 2007. MEMC announces board member Marshall will be ... Semiconductor International October 31, 2008 - Technology News Magnetism and Nanocrystals Promise Denser Storage, New Devices An Oak Ridge National Laboratory research team is working on creating a new class of nanomaterials. Simple materials such as gold and silicon ... Semiconductor International October 30, 2008 - Industry News Chip Package Designer Unwraps Image Effort Chipmaker Tessera picked a tough time to try to find stability. Just as the economy has tanked, the company forged ahead with plans to ... Semiconductor International October 30, 2008 - Industry News TI Blitzes to Improve Fab Productivity Texas Instruments Inc. has used rapid improvement events, or kaizen blitzes, to sharply improve productivity at the DFAB in Dallas. ... Semiconductor International October 28, 2008 - Industry News Oerlikon Sells Optics Business at Balzers Oerlikon OC said it agreed to sell its optical coatings business located at Balzers, Liechtenstein, to a management buyout group. Oerlikon said ... Semiconductor International October 28, 2008 - Industry News ISMI Outlines 450 mm Wafer, NGF Roadmaps ISMI managers described progress at the 450 mm wafer Interoperability Text Bed, and described the Phase 2 roadmap at last week's ISMI ... Semiconductor International October 27, 2008 - Industry News MagnaChip ends imaging work in effort to save $50M In making the exit, the company said it incurred impairment charges of $26.3 million in its Q3 and expects to record approximately $15.2 ... Semiconductor International October 24, 2008 - Industry News 3-D Startup Is Ahead of Its Time As the 3-D integration infrastructure evolves, it is becoming clear that low-cost, reliable bonding technology is required for 3-D IC ... Semiconductor International October 23, 2008 - Industry News Metrology Conference Preparations Are Underway The second call for papers has gone out for Frontiers of Characterization and Metrology for Nanoelectronics, a conference that I consider as the ... Semiconductor International October 23, 2008 - Industry News Environmental Regulations Growing More Complex Participants at an ISMI meeting on emerging environment, safety and health (ESH) regulations said the Stockholm Convention on Persistent ... Semiconductor International October 21, 2008 - Industry News Webcast: SIA Annual Semiconductor Industry Global Sales Forecast The global economy is entering a period of unprecedented uncertainty, driven largely by the crisis in subprime home mortgages here in the ... Semiconductor International October 16, 2008 - Industry News IMEC Views 3-D Stacking as System Design IMEC managers said the research center has made significant progress creating test 3-D ICs, using die-to-die stacking. IMEC's Eric Beyne ... Semiconductor International To find more articles from Semiconductor International, use the search form below. Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.