July 11, 2008
YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
 YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech 
Case Study & Application Note
How flat are your substrates?
Packaging coplanarity issues begin with the flatness of your substrates. Learn more...
Cyber Technologies 
Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
 Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials…
Heraeus, Inc. 
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Clean & Efficient WLP Photoresist Removal
 EKC162 – Tested & Proven; Faster, Too
EKC's WLP Photoresist Removers: a tested and proven solution for area array packaging requirements (stencil printed, plated, pillared or C4 applied). Removes resist faster, at lower temperatures, without attacking polyimides or metals. Learn more…
DuPont EKC Technology 
Amkor Technology lowers 2Q revenue guidance
Microchip assembly and test company Amkor Technology Inc. lowered its second-quarter revenue guidance, citing disruptions in production from ...
AP
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Chip R&D spending to reach $49.2 billion in 2008
Worldwide spending on semiconductor research and development (R&D) grew 12% in the first quarter of 2008 compared to the first quarter of ...
Purchasing
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Weak PND market worries GPS chip suppliers
With global demand of Portable Navigation Device (PND) products declining rapidly in the first quarter and inventory building up, the average ...
DigiTimes
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France backs $5 billion program aimed at Crolles3
Seeking to foster innovation in microelectronics in the Grenoble area, France has agreed to provide subsidies to a new alliance between ...
EETimes
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Taiwan should allow more wafer plants in China: Ma
President Ma Ying-jeou said it's necessary and reasonable for Taiwan to relax laws on setting up wafer plants in China. Ma noted that US ...
Radio Taiwan International
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GSI Group to acquire Excel Technology for $360 million
Provider of precision motion products and lasers for medical, electronics, industrial, and semiconductor applications, GSI Group ...
Laser Focus World Magazine
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Solar Wafer Prices On the Rise Again?
When considering solar stocks, the conversation always turns to the cost of silicon and solar wafers, the raw materials that go into solar ...
Seeking Alpha
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Intel sells Impinj RFID operation, deal expected to stimulate market
Today’s announced deal will see Seattle-based Impinj add to its existing UHF RFID portfolio of tag chips and fixed-reader products with ...
EDN
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The Economics of Solar Power
A new era for solar power is approaching. The rising cost of fossil fuels and better technology is making solar, long derided as ...
Earthtoys
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Kawasaki Microelectronics Adds Multiple MIPS Technologies Processor Cores to Its ASIC IP Portfolio
MIPS Technologies, Inc. announced that Kawasaki Microelectronics (K-micro), a leader in advanced ASICs, licensed multiple MIPS cores for ...
FOX Business
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NexPlanar Secures $14.5 Million to Commercialize Next Generation Semiconductor CMP Pad Technology
NexPlanar Corporation recently completed a $14.5 million round of funding to commercialize the next generation of chemical mechanical ...
MarketWatch
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IC Production on 450-mm Wafers: Still Never
Wright Williams & Kelly, Inc. (WWK), a cost & productivity management software and consulting services company, announced today the results ...
MarketWatch
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Die Bonding Made Easy
Precision X-Form Needles
 The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology 
New Photovoltaic Coating System
Precision coating of solar wafers
 To apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more…
Ultrasonic Systems, Inc. 
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