We search for industry news, so you don't need to.
 
Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers
July 10, 2008


Improve Your Uptime
High Precision Dispense Tips
imageThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology

Advertisement
New Photovoltaic Coating System
Precision coating of solar wafers
imageTo apply a thin, uniform layer of phosphoric acid or phosphoric oxide based dopants and other proprietary coatings for the production of solar cells, USI has Technology for every application. Learn more…
Ultrasonic Systems, Inc.
Letters Submit

Wanted…For Ruining your Production
The $10 counterfeit component
imageSuccess begins with confidence in knowing counterfeit components are not ruining your production. Dage can help you avoid costly imitations. Learn more with this informative white paper…
Dage Precision IndustriesAdvertisement
Top Story  
Rohm and Haas to be Acquired by Dow Chemical
Rohm and Haas Company announced it has entered into an agreement with The Dow Chemical Company, under which Dow will acquire all of the ...
Rohm and Haas

Semiconductor Packaging News
Advertising delivers!
Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more...
Semiconductor Packaging News
Industry News  
Infineon top industrial semiconductor supplier
According to Semicast's final vendor ranking for its 'Industrial/Medical Semiconductor Service', Infineon Technologies is ranked as the ...
Dataweek
Intel Antes Up On Solar with German Thin-Film Solar Sulfurcell
On the heels of Intel’s announcement that it had spun out and funded a solar startup doing “advanced solar cell technology” called ...
Earth2Tech
MEMS see growth opportunities in consumer electronics
Due to the growing need for miniaturisation and improved functionality, a variety of consumer electronics products have increasingly begun to ...
Dataweek
The Economics Of Solar Power
A new era for solar power is approaching. Long derided as uneconomical, it is gaining ground as technologies improve and the cost of ...
Forbes
Cell processor trio extend R&D with Georgia Tech
IBM, Toshiba and Sony will continue work on the Cell processor with researchers at the Georgia Tech College of Computing. As well as the ...
EETimes
Chemical used in chips, LCDs under fire
Scientists are expressing concern over a chemical widely used in the manufacture of computers and flat-screen televisions. Nitrogen ...
EETimes
Ceradyne Packs On SemEquip
Technical ceramic product manufacturer Ceradyne announced it would acquire privately held SemEquip, a company that develops materials ...
Forbes
Rich Feature Set is a Key Requirement in Intensively Competitive Microcontrollers Market
The microcontroller market's increasing tilt toward standard cores such as the ARM and 8051 further propels efforts towards differentiation. ...
Newswire Today

Hesse & Knipps BONDJET BJ920
heavy wire bonder integrates pull and shear test
imageHesse & Knipps BONDJET BJ920 heavy wire bonder gives you speed, accuracy and the largest bonding area - it is also the only bonder with integrated pull and shear test. Learn more…
Hesse & Knipps
Technology News  
Room temperature superconductivity
Scientists at the University of Cambridge have for the first time identified a key component to unravelling the mystery of room ...
Science News
IBM cools 3D chips with H2O
IBM researchers, in collaboration with the Fraunhofer Institute in Berlin, recently demonstrated a prototype that integrates the cooling ...
Dataweek
Flexible thin film solar panels
GP Solar has released a range of flexible thin film solar panels to the market. These solar panels utilise triple-junction solar cells ...
Dataweek
Researchers Enhance Lithography Light Sources
A breakthrough discovery at UC San Diego may help aid the semiconductor industry’s quest to squeeze more information on chips to accelerate ...
Science Daily
Matheson "pico-trap" produces new levels of semiconductor process gas purity
Matheson Tri-Gas Electronics today introduced its patented "PICO-TRAP" (TM) Ultra-Purification System for removing volatile metal ...
Compound Semiconductor

YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
imageYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech

Corporate News Submit
DuPont Performance Elastomers To Introduce Kalrez® 8900 Parts At Semicon West
DuPont Performance Elastomers will introduce Kalrez® 8900 perfluoroelastomer parts specifically designed for semiconductor ...
DuPont Performance Elastomers
Cree Delivers GaN Process Design Kit
Cree, Inc. announces the availability of a leading edge process design kit (PDK) for GaN HEMT process technology. The Cree PDK, developed for ...
Cree, Inc.
EV Group receives multi-million euro order from ST
EV Group (EVG)announced it has received a major multi-million-euro order from STMicroelectronics for its 300-mm bonding, alignment and ...
EV Group
New FabVi Software from CIMAC Clones Semiconductor Fab via Simulation to Debug, Diagnose and Trouble Shoot MES Software
A new simulation software application known as FabVi (Fab Virtual image) clones semiconductor equipment automation and AMHS automated material ...
CIMAC
Dage introduces enhanced High-Speed Bondtester toolset at Semicon West
Dage Precision Industries is pleased to announce that it will introduce its newly enhanced 4000HS High-Speed Bondtester toolset at the ...
Dage Precision Industries
Conductive Adhesives Designed Specifically for Flexible Circuits Shown at SEMICON West
A line of fast-setting, one-component conductive adhesives designed for the connection of passive components and bare dies on lead frames and ...
Heraeus
Palomar Showcases Precision Microelectronics Applications at SEMICON West
Palomar Technologies will showcase the latest application capabilities of its high value-added microelectronic packaging services and equipment ...
Palomar Technologies
Indium Features Pb-Free No-Clean Die-Attach Solder Paste at Semicon West
Indium9.32 Die-Attach Solder Paste is a halogen-free, no-clean, die-attach solder paste that continues to be an industry leader around ...
Indium Corporation
SEMI Theater Presents
We’ve gathered together key market analysts to provide you with market briefings from several different vantage points. From materials and ...
SEMICON
ZESTRON to Showcase Superior Cleaning Agent Technologies at SEMICON West
ZESTRON America will be presenting its latest water-based cleaning technologies during the upcoming SEMICON West tradeshow from July 15th ...
ZESTRON
Today's Sponsor

Case Study & Application Note
How flat are your substrates?
image Packaging coplanarity issues begin with the flatness of your substrates. Learn more...
Cyber Technologies

Advertisement
Heraeus - Celebrating 40 years
of USA Manufacturing Excellence
imageHeraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. Our consolidated production area is a state-of-the-art facility with key personnel in sales, quality and research. Learn more about Heraeus materials…
Heraeus, Inc.

Advertisement
Clean & Efficient WLP Photoresist Removal
imageEKC162 – Tested & Proven; Faster, Too
EKC's WLP Photoresist Removers: a tested and proven solution for area array packaging requirements (stencil printed, plated, pillared or C4 applied). Removes resist faster, at lower temperatures, without attacking polyimides or metals. Learn more…
DuPont EKC Technology


Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News
Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA
Copyright © 2008 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.