We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why… Juki Corporation YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech   Industry and Technology News Index July 14, 2008  -  Click the title to read the full article. Shrinking chip could keep us on track with Moore's law Silicon chips could become even more densely packed with transistors thanks to a breakthrough that carves features in silicon that are ... New Scientist We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from New Scientist October 2, 2008 - Technology News Paper transistors make for disposable electronics Paper transistors could end the hunt for alternatives to silicon chips and herald the introduction of electronic devices cheap and bendy ... New Scientist Tech August 1, 2008 - Technology News Solar-cell material can soak up more Sun Today's solar cells absorb only visible light, wasting the infrared that makes up half of the Sun's output that reaches Earth. But a new ... New Scientist July 28, 2008 - Technology News Beam sharpener produces laser 'knife' You may think of lasers as needle-like crisp beams. But the semiconductor lasers used for everything from CDs to fibre-optic ... New Scientist July 14, 2008 - Technology News Shrinking chip could keep us on track with Moore's law Silicon chips could become even more densely packed with transistors thanks to a breakthrough that carves features in silicon that are ... New Scientist To find more articles from New Scientist, use the search form below. NEW Hesse & Knipps BONDJET BJ915L for your leadframe applications Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more… Hesse & Knipps Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.