We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers NEW Hesse & Knipps BONDJET BJ915L for your leadframe applications Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more… Hesse & Knipps Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation   Industry and Technology News Index July 11, 2008  -  Click the title to read the full article. NexPlanar Secures $14.5 Million to Commercialize Next Generation Semiconductor CMP Pad Technology NexPlanar Corporation recently completed a $14.5 million round of funding to commercialize the next generation of chemical mechanical ... MarketWatch We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from MarketWatch July 11, 2008 - Industry News NexPlanar Secures $14.5 Million to Commercialize Next Generation Semiconductor CMP Pad Technology NexPlanar Corporation recently completed a $14.5 million round of funding to commercialize the next generation of chemical mechanical ... MarketWatch July 11, 2008 - Industry News IC Production on 450-mm Wafers: Still Never Wright Williams & Kelly, Inc. (WWK), a cost & productivity management software and consulting services company, announced today the results ... MarketWatch July 9, 2008 - Industry News Applied Materials says offer for ASM International unit 'full and fair' "I think we have given a very full and fair offer," Splinter said during a press conference at the ground-breaking of a new manufacturing ... MarketWatch March 19, 2008 - Industry News Applied Materials upgraded on solar power promise Pang said he expects Applied Materials to unveil "positive developments" in its solar power business in the coming quarters. While Applied ... MarketWatch February 27, 2007 - Industry News Japan's Asahi Glass said supplying Taiwan flat-panel company The Japanese company's production of glass for Chi Mei Optoelectronics' 6G and above large LCD panels will break Corning Inc.'s (GLW) monopoly in ... MarketWatch February 15, 2007 - Industry News Taiwan Semiconductor chief sees industry growth averaging 6% through 2010 The slowdown in growth is one of the challenges facing the semiconductor industry, together with maintaining profitability, Taiwan Semiconductor ... MarketWatch January 5, 2007 - Top Story News South Korea launches full-scale probe of Qualcomm South Korea's antitrust regulator said Thursday it has launched a full-scale investigation into alleged unfair market practices of U.S.-based Qualcomm ... MarketWatch November 9, 2006 - Top Story News Taiwan Semi to build new semiconductor factory plant in April Taiwan Semiconductor Manufacturing Co. (TSM) said it plans to build its third 12-inch wafer factory in Taiwan's Hsinchu Science Park ... MarketWatch November 7, 2006 - Industry News Freescale Semi agrees in principle to settle suits Freescale Semiconductor Inc. (FSL) said that it agreed in principle with plaintiffs to settle six purported class-action suits against the ... MarketWatch October 27, 2006 - Industry News AMD expects price war with Intel to cool Advanced Micro Devices Inc. (AMD) expects its price war with arch-rival Intel Corp. (INTC) to cool next year, according to the Financial Times ... MarketWatch October 17, 2006 - Top Story News Philips Electronics profit nearly triples Dutch conglomerate Philips Electronics on Monday reported nearly a tripling of its third-quarter profit on the sale of its semiconductor-making ... MarketWatch October 10, 2006 - Industry News Taiwan Semiconductor's September revenue rises 6.5% Taiwan Semiconductor Manufacturing Co. (TSM) said its revenue in September totaled NT$26.86 billion, up 6.5% from NT$25.23 billion in ... MarketWatch September 22, 2006 - Industry News Silicon Labs adds to warnings from chipmakers Silicon Laboratories Inc. cut its quarterly financial targets late Wednesday, adding to the list of chip merchants lowering their ... MarketWatch August 28, 2006 - Industry News Taiwan United Microelectronics ups stake in memory-chip maker ProMOS Taiwan's United Microelectronics Corp. (UMC), which became the second-largest shareholder in ProMOS Technologies Inc. (5387.OT) earlier this ... MarketWatch August 4, 2006 - Industry News United Microelectronics profit leaps nearly twenty-fold United Microelectronics Corp., the world's second-largest contract chip-maker, said Wednesday that quarterly net profit increased nearly twenty ... MarketWatch July 25, 2006 - Industry News Philips Electronics gets U.S. antitrust nod to buy New York company Philips Electronics NV (PHG) received U.S. antitrust approval to acquire one of its major suppliers, Intermagnetics General Corp. (IMGC). ... MarketWatch July 13, 2006 - Industry News South Korea's Hynix ends talks with ST Micro on expanding chip alliance South Korea's Hynix Semiconductor Inc. said it decided to end talks with European chip maker ST Microelectronics N.V. (STM) on ... MarketWatch To find more articles from MarketWatch, use the search form below. Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.