A line of fast-setting, one-component conductive adhesives designed for the connection of passive components and bare dies on lead frames and printed circuit board substrates is being introduced by the Contact Materials Division (CMD) of Heraeus at this year's SEMICON West Show (Booth #7551). Ideal uses for the Heraeus conductive adhesives include smart cards and flexible circuits found in camera phones and automotive or semiconductor applications.
Unlike many conductive adhesives on the market, the PC3200 series from Heraeus is a one-part system that requires no premixing. It does not have to be stored below 40ºC nor shipped in dry ice, causing it to be considered as a hazardous material shipment. The adhesives can be shipped with standard ice packs and stored in a standard freezer. They are also solvent-free and are formulated for stencil print, screen printing or dispensing applications. The PC3200 series provides high electrical and thermal conductivity with excellent adhesion properties.
In addition, since the PC3200 series of conductive adhesives is manufactured at Heraeus' West Conshohocken, PA facility, the company's product development team can work with customers to develop modified formulas to meet individual processing criteria for optimum yields and performance.
Also on display will be a new line of non-conductive adhesives (NCA line) which have proven successful in various applications, such as chip attach and SD card assembly. The NCA line from Heraeus features exceptional purity for high reliability and quick cure times.
Also at SEMICON West, Hereaus will showcase its line of water-soluble ball dip pastes for solder on pad (SOP) substrates. The BD paste series enables manufacturers to utilize SOP substrates while maintaining outstanding yields. Since the convex surface of the SOP substrate causes solder ball movement during reflow when using the traditional flux and drop process, the BD paste allows the balls to be dipped in solder before placement.
In addition to the BD paste series, Heraeus will exhibit its bonding wire and ribbon and lead-free solder pastes.
About Heraeus Contact Materials Division
The Heraeus Contact Materials Division (CMD) is part of Heraeus, the precious metals and technology group with headquarters in Hanau, a globally active, family-owned company with business areas that include precious metals, sensors, dental and medical products, quartz glass and specialty lighting sources. With a business volume of over €10 billion and more than 11,000 employees in over 100 companies worldwide, Heraeus has been an internationally recognized specialist in materials and precious metals for more than 150 years.
The Contact Materials Division is one of the world's leaders in materials used to manufacture high-performance circuitry, semiconductors and surface mount assemblies. Industry leaders in both the automotive and semiconductor markets rely on the Heraeus name when developing and manufacturing their products.
All Heraeus products are supported by in-depth process knowledge, personalized service, and custom solutions for emerging applications.
With multiple R&D sites and a global network of production and support facilities, Heraeus continually introduces new products that meet both local and global requirements. The company's goal is to achieve a level of quality and performance unsurpassed in the industry.
