Manassas, Va. – ZESTRON America will be presenting its latest water-based cleaning technologies during the upcoming SEMICON West tradeshow from July 15^th to July 17^th at the Moscone Center, San Francisco, California (Booth # 7236).

MPC Technology based products as well as our latest FAST Technology-based cleaning agents will be showcased as the most effective cleaning choices to remove the widest range of flux residues from lead-frames, wafers after bumping process, flip-chip as well as BGAs. As a result of ZESTRON’s internal cleaning studies, we were able to further increase the pull-/shear forces prior to wire bond connections, reduce migration satellites after wafer bumping, improve interfacial bond strengths on flip chip assemblies and provide failure-free BGAs after balling.

In addition to the latest chemical product innovations, ZESTRON is now also offering its worldwide customer base free-of-charge cleaning trials supported by the largest selection of inline, spray-in-air batch and ultrasonic equipments in the industry! State-of-the-art Application Technology Centers are conveniently located in the US, Europe and Asia.