Fremont, California – Dage Precision Industries, a Nordson company (NASDAQ: NDSN) and the industry leader in bondtesting technology, is pleased to announce that it will introduce its newly enhanced 4000HS High-Speed Bondtester toolset at the Semicon West show scheduled to take place in San Francisco, California on July 15-17, 2008.

High strain rate bondtesting using the Dage 4000HS High-Speed Bondtester has become an established technique for detecting brittle fracture failures in lead-free materials. Dage’s new 4000HS software and hardware toolset offers even more capability for bondtesting analysis and process control. This toolset includes the new high-speed trigger capture software and new rising table work holder for cold bump pull bondtesting. These new toolset features further enhance the application of high-speed bondtesting, a technology pioneered by Dage.

Conventional force measurement provides poor discrimination between different failure modes, but bond failure energy measurements give the possibility of detecting subtle differences between solder materials, bump metallization, and process parameter changes. Using energy as a metric, high strain rate bondtesting becomes a production monitor. The basis for energy measurements are force-displacement curves generated for each test. Bands of values can be assigned to particular failure modes and correlated with the same failure modes in board level drop testing.

The Dage 4000HS High-Speed Bondtester is the only test instrument on the market today that provides energy measurements during bondtesting and assures full compliance with JEDEC standards and offers world class analysis of microelectronic solder joint integrity and reliability.