SEMICON West Booth #7515

Presenting paper “Chain Wire Bonding of a RF-SOE Package Using a Gold Ball Bonder”

Carlsbad, Calif. – Palomar Technologies, provider of precision automation equipment and contract assembly services for microelectronics, will showcase the latest application capabilities of its high value-added microelectronic packaging services and equipment at SEMICON West 2008 booth #7515, in San Francisco, California from July 15-17, 2008. Palomar is ready to address equipment and application concerns for those involved with optoelectronic, RF, and microelectronic packaging needs in the solar, LED, wireless, photonic, microwave, photovoltaic, computer, automotive, aerospace, and medical industries. In addition, the paper, Chain Wire Bonding of a RF-SOE Package using a Gold Ball Bonder, will be presented on July 14, 2008 at the IMAPS/SEMI Advanced Technology Workshop by Palomar Technologies senior scientist Dan Evans and systems engineer Albert Perez.

Featured applications include very high precision epoxy die attach solutions for vertical-cavity surface-emitting lasers (VCSELs), transmitter optical sub-assemblies (TOSAs), andreceiver optical sub-assemblies (ROSAs). Palomar’s Model 6500 precision automated assembly work cell and Model 8000 high-speed automated gold wire bonder automate the assembly of TOSA/ROSA protocol-independent CWDM-based optical sub-assemblies. The Model 6500 achieves accuracy down to 1.5 micron 3 sigma while the Model 8000 has an extra large 12” wide x 6” deep (304.8mm x 152.4mm) work area and enables wire bonding into packages as deep as 0.750” (10.05mm) with an industry-best finished bond height consistency of 2 microns, 3 sigma. Palomar Microelectronics can provide the quick-turn product development, prototyping, test, and contract assembly services, or EMS and OEM companies can purchase the equipment.