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  Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Asymtek
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Cyber Technologies is leader in
laser-based, high-resolution 3D inspection for microelectronics
3D Inspection Our world-class clients rely on our CyberScan Vantage Systems for inspection of: Substrate Flatness, Bump and Ball Coplanarity, Wire Bond Loop Height, Film and Paste Thickness & Volume and Transparent Materials Deposition. Learn more...
Cyber Technologies




Die attach and flip chip placement
CX SeriesThe Juki CX Series
The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why…
Juki Corporation
  Industry and Technology News Index
July 10, 2008  -  Click the title to read the full article.

Rohm and Haas to be Acquired by Dow Chemical
Rohm and Haas Company announced it has entered into an agreement with The Dow Chemical Company, under which Dow will acquire all of the ...
Rohm and Haas
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More from Rohm and Haas
July 10, 2008 - Top Story News
Rohm and Haas to be Acquired by Dow Chemical
Rohm and Haas Company announced it has entered into an agreement with The Dow Chemical Company, under which Dow will acquire all of the ...
Rohm and Haas
July 11, 2006 - Corporate News
Rohm and Haas Electronic Materials Aligns Circuit Board Technologies' Global Strategy
Rohm and Haas Electronic Materials, Circuit Board Technologies (CBT), has announced several changes to its North American and European business...
Rohm and Haas
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YESTech's M1m AOI Inspection for Microelectronics
Quick Set-up, high defect coverage, intuitive user interface
M1mYESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more…
YESTech




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