We search for industry news, so you don't need to.   Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers High-Speed Stamp Soldering New white paper This paper examines stamp soldering, a solution that provides consistent amounts of molten solder onto a printed circuit board using static volumetric solder stamps during the through-hole soldering process. Click to learn more… Juki Corporation YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech   Industry and Technology News Index July 10, 2008  -  Click the title to read the full article. Matheson "pico-trap" produces new levels of semiconductor process gas purity Matheson Tri-Gas Electronics today introduced its patented "PICO-TRAP" (TM) Ultra-Purification System for removing volatile metal ... Compound Semiconductor We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Compound Semiconductor October 10, 2008 - Technology News IQE joins European-funded 'VISIT' Program IQE of Cardiff, UK, was welcomed has a member of the €3.5 million European program to develop photonics components for broadband and ... Compound Semiconductors September 30, 2008 - Technology News IQE provides epitaxy for US graphene project Innovative molecular beam epitaxy and chemical vapor deposition processes are central to the development of graphene transistors in a DARPA ... Compound Semiconductor September 23, 2008 - Industry News UK cracks GaN-on-silicon LED issues A government-backed LED project produces crack-free GaN-on-silicon epiwafers with an internal quantum efficiency of 40 percent. ... Compound Semiconductor August 14, 2008 - Technology News Advanced silicon process from IQE set to enter production IQE plc, the leading global supplier of advanced semiconductor wafer products and wafer services to the semiconductor industry, is ... Compound Semiconductor July 10, 2008 - Technology News Matheson "pico-trap" produces new levels of semiconductor process gas purity Matheson Tri-Gas Electronics today introduced its patented "PICO-TRAP" (TM) Ultra-Purification System for removing volatile metal ... Compound Semiconductor June 4, 2008 - Technology News IMEC makes crack-free GaN on 8-inch silicon A breakthrough in GaN-based microelectronics could be on the cards, after researchers from IMEC and Aixtron produced a crack-free nitride ... Compound Semiconductor February 15, 2008 - Technology News Toho Technology to sell Nanometrics' III-V characterization lines in Japan Nanometrics Incorporated has named Toho Technology Corp. as exclusive distributor in Japan for six Compound Semiconductor and Materials ... Compound Semiconductor December 12, 2007 - Industry News Seoul Semiconductor Claims Thinnest Chip LED Seoul Semiconductor has launched its new chip LED. The company contends that the design of the chip LED, for which the company has applied ... Compound Semiconductors Online August 2, 2007 - Industry News Orders increase again at strengthening Aixtron Despite a sequential dip in quarterly sales, semiconductor equipment vendor Aixtron is witnessing ongoing strong demand, particularly ... Compound Semiconductor June 20, 2007 - Technology News Diodes come in high and wide at Laser show Alfalight, JDSU and nLight vie for attention with their new product releases at the Laser – World of Photonics show in Munich this week, ... Compound Semiconductor April 4, 2007 - Technology News Berlin researchers buy reactor for UV work A leading optoelectronics research group at the Technical University of Berlin has ordered a Thomas Swan system to develop high-brightness ... Compound Semiconductor March 28, 2007 - Technology News 980nm pump laser makers go for power play Laser chip manufacturers JDSU, Bookham and Lumics are all showing off new high-power designs at this week’s optical fiber communication (OFC) ... Compound Semiconductor March 28, 2007 - Industry News Motorola bombshell could hit Skyworks and RFMD Last week's dismal trading update from Motorola looks like it could spell trouble for GaAs chip manufacturers RF Micro Devices and Skyworks ... Compound Semiconductor March 26, 2007 - Technology News Arima Opto Spins off Laser Diode Business Arima Optoelectronics (Arima Opto), a Taiwan-based LED manufacturer, reported that it will spin off its laser diode manufacturing division to ... Compound Semiconductors March 23, 2007 - Industry News IPG to expand laser fabrication with Veeco tools IPG Photonics, the fiber laser maker that owns a compound semiconductor fabrication facility at its Oxford, MA, headquarters, has ordered two ... Compound Semiconductor March 22, 2007 - Industry News Tekcore moves into GaN laser production Epitaxy equipment vendor has received a purchase order from the Taiwanese company Tekcore for a production system designed to manufacture blue ... Compound Semiconductor March 22, 2007 - Industry News More opto consolidation as CyOptics buys Apogee InP optoelectronic component foundry CyOptics is set to acquire fellow chip manufacturer and close neighbor Apogee Photonics. The deal is a clear ... Compound Semiconductor March 2, 2007 - Industry News Yield improvements spin AXT to operating profit GaAs, InP and germanium substrate vendor AXT has capped its turnaround story by posting a net profit of $3.4 million for the quarter that ended on December 31. CEO Phil Yin, who has ... Compound Semiconductor January 24, 2007 - Technology News Cree qualifies first 4-inch LED process SiC and GaN chip manufacturer Cree says it has qualified 4-inch wafer processes for LED and Schottky diode fabrication. In an investor conference call to discuss ... Compound Semiconductor January 19, 2007 - Industry News Bede encouraged by return to profit X-ray inspection equipment vendor Bede has seen a big jump in orders for its characterization tools, and turned a small pre-tax profit in the final ... Compound Semiconductor January 16, 2007 - Technology News GCS foundry deal signals shifting opto strategies In a strategic move that highlights an accelerating shift towards outsourced wafer processing of optical telecommunication devices, Xponent ... Compound Semiconductor January 11, 2007 - Technology News RF Micro switches on GaAs PHEMT capability RF Micro Devices has launched two new types of switch for use in cell-phones, cellular infrastructure, and wireless LAN applications. Last ... Compound Semiconductor January 9, 2007 - Industry News Finnish epi start-up scoops venture gong EpiCrystals, a Finnish start-up company specializing in laser diode structures, has beaten off nearly 500 rivals to win the European Venture ... Compound Semiconductor December 15, 2006 - Technology News GaAs chipmakers urged to get multifunctional GaAs market analysts say that with demand from cellular backhaul applications flattening out, device makers will have to develop multi- ... Compound Semiconductor December 7, 2006 - Industry News Market demand provokes AlGaInP ramp at SDK Show Denko (SDK) is stepping up its AlGaInP chip capacity with a $13 million investment. SDKs upgrade will include an expansion of MOCVD ... Compound Semiconductor To find more articles from Compound Semiconductor, use the search form below. NEW Hesse & Knipps BONDJET BJ915L for your leadframe applications Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more… Hesse & Knipps Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. 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