Indium9.32 Die-Attach Solder Paste is a halogen-free, no-clean, die-attach solder paste that continues to be an industry leader around the world. It is also used in high-volume manufacturing for Pb-Free die-attach applications.

For years, solder paste die-attach customers have been cleaning after reflow, due to their need for reliable wire-bonding and strong molding compound adhesion. Since the adoption of clip-bonding as an industry-wide manufacturing method, customers have found Indium9.32 offers a reliable no-clean die-attach solution. Indium9.32 has been tested, approved, and used in high volume manufacturing by industry leaders in power semiconductor manufacturing.

Indium9.32 exhibits low voiding (<5% total voiding is achievable in most instances), as well as ultra-low residue, which ensures compatibility with a wide variety of molding compounds.

The benefits customers repeatedly obtain by using Indium9.32 are increased cost savings and the highest finished goods reliability.

Indium will be exhibiting at Booth 7834