DEK Packaging and Solar Advancements on Display at Semicon West
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 – 17 at San Francisco’s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard™ Platinum stencil technology.
To facilitate high volume, ultra-precise coating of wafers with die attach materials, epoxy or protective backside coatings down to 25 microns in thickness, DEK has developed a breakthrough process solution termed DirEKt Coat™. Unlike conventional dispensing techniques that cannot achieve emerging UPH requirements, often cause reliability issues due to poor or uneven material coverage and limit chip footprints because of fillet formation and resin bleed challenges, DEK’s DirEKt Coat offers a high throughput, screen printing-based solution that eliminates many of the inherent challenges associated with serial, dispensing methodologies. Enabled by an ultra-flat pallet for maximum wafer stability and uniformity, a specialty squeegee and a wafer shield, the DirEKt Coat system allows for precise, high-speed coating processes on wafers as thin as 100 microns and up to 300mm in diameter. Additional benefits include as much as a 20% to 30% reduction in materials cost as compared to die attach film products, improved inventory management, customer-specified bondline thickness control and footprint reduction through the elimination of the fillet. Like all DEK systems, the versatility of DirEKt Coat’s host print platform allows for extremely low cost of ownership, as the system can easily be re-deployed to run a variety of other processes.
Extending its mass imaging ingenuity to other disciplines, DEK has drawn from its 40-year experience in surface-mount, packaging and solar technologies to develop and deliver a complete solar cell metallization line capable of producing 1200 wafers per hour. DEK-engineered loading, buffering, inspection, wafer-flipping and printing systems are integrated with externally sourced advanced dryers to offer a total front-to-back solution for high-volume photovoltaic production. DEK’s Alternative Energies staff will be on hand over the three days of the Semicon West event to discuss DEK Solar process advantages and integration of its PVL1200 loader, PVB1200 buffer, PVI1200 inspection station, PVF1200 buffer/flipper and PVP1200 high-precision screen printers.
As a key enabler for all materials printing processes, robust stencil technologies are essential for high-yield manufacturing operations. In addition to its stainless steel, electroformed, nickel and PumpPrint™ foils, DEK’s pioneering VectorGuard™ interchangeable stencil system now allows for ultra fine-pitch semiconductor printing with its latest Platinum foil technology. Ideal for applications such as BGAs, flip chips, direct chip attach and wafer-level packaging, the micro-engineered VectorGuard Platinum delivers a robust stencil solution capable of achieving apertures of 20µm on 50µm pitch. As a VectorGuard product, the inherent flexibility benefits of quick product changeover and cost savings are at the core of the Platinum offering.
All of these technologies and DEK’s expert staff will be on hand throughout the three-days of Semicon West. Show delegates are invited to visit booth #8111 in West Hall, Level 2 of Moscone Center to find out how DEK can improve process efficiency and boost productivity.
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.
January 8, 2010 DEK customers can now extend their Horizon even further Mass imaging specialist DEK has unveiled further enhancements to its popular Horizon screen printing platform. Now equipped with state-of-the-art ... DEK
November 13, 2009 DEK Solar adds new Project Manager to the team Following the recent launch of the PV3000 solar metallization line, DEK Solar has extended its team even further with the addition of new Solar ... DEK
August 13, 2009 DEK Raises the Bar on DirEKt Coat™ Technology Anticipating future requirements for high-volume wafer adhesive and coating applications, DEK has enhanced the process capability of its ... DEK
July 31, 2009 DEK Raises the Bar on DirEKt Coat™ Technology Anticipating future requirements for high-volume wafer adhesive and coating applications, DEK has enhanced the process capability of its ... DEK
May 1, 2009 DEK PV1200 attracts huge interest at Photon Munich Screen printing specialist DEK attracted an unprecedented amount of interest with its compelling next-generation PV1200 solar metallization ... DEK
February 6, 2009 DEK Solar illuminates sector with truly global reach Delivering a fast-track to effective commercial photovoltaic production, DEK’s advanced PV1200 metallization line continues to build on the ... DEK
November 10, 2008 DEK Solar expands global reach with new additions DEK Solar has announced two new key personnel additions to its dynamic team, expanding the company’s capabilities in the fast-growing ... DEK
To find more corporate news releases from DEK, use the search form below.