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  Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
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Does your reflow offer guarantees?
Ours Does
ATEK Reflow• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
ATEK Systems Group
White Paper Download Index
Ribbon Bonding for High Frequency Applications

Due to increasing frequencies in all fields of information technology, ribbon bonding is gaining more widespread attention from designers of applications which were traditionally bonded with round wire and ball bonders. This presentation will review the advantages of ribbon bonding ...
Hesse & Knipps

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Solar wafer coating - White paper
USI has developed Nozzle-less
Solar wafer coatingUltrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more…
Ultrasonic Systems, Inc.


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