We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers June 30, 2008 YESTech's M1m AOI Inspection for Microelectronics Quick Set-up, high defect coverage, intuitive user interface YESTech's advanced Thin Camera™ and Fusion Lighting technologies deliver high-speed automated device inspection with exceptional defect coverage. The M1m inspects bond wires, die placement, bumps, SMT components and dispensed materials, at line speeds all within a footprint less than 1 sq. meter. Learn more… YESTech Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Letters Submit Design High Flex Cables On-Line with Web Tool Gore's design tool provides engineers with quick, reliable cable and interconnect solutions for semiconductor equipment. Gore offers components to drive and control a motion system: shield/unshielded power and signal, video, Ethernet, IEEE 1394 and pneumatic lines. Learn more… W. L. Gore & Associates Top Story   Fabless chip market up 16% in Q1, says GSA Fabless semiconductor company revenue totaled $13.4 billion in the first quarter of 2008, up 16 percent compared with the first quarter of ... EETimes Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why… Juki Corporation Industry News   Global PC Shipments Hang Tough in Q1 Despite challenging economic conditions, worldwide PC shipments in the first quarter of 2008 rose in accordance with normal seasonal patterns ... iSuppli Corporation Micron shares tumble on wider quarterly loss Shares of Micron Technology Inc. fell nearly 13% after the company reported a slightly wider fiscal third-quarter loss due to ongoing ... Market Watch Citing Need for Assessments, U.S. Freezes Solar Energy Projects Faced with a surge in the number of proposed solar power plants, the federal government has placed a moratorium on new solar projects on ... The New York Times Bill Gates signs off at Microsoft Bill Gates spent his last day at Microsoft Friday, bidding a teary goodbye to the company he built into a global software colossus. ... AFP Global chip sales seen 7% up in May The three-month moving average of global chip sales is estimated to have come in at $21.7 billion in May, up a healthy 7 percent on the $20.3 ... EETimes Apple notebook shipments up 61% A new report from market research firm DisplaySearch shows Apple’s worldwide notebook shipments grew 61 percent from the first quarter ... Macworld HP, Dell Widen PC Lead Hewlet-Packard, Dell, and Acer retained the top three spots in the worldwide PC market rankings, according to a report published Friday ... PC Magazine Has Micron turned a corner?: Third-quarter losses were still big, but sales and DRAM prices were up and costs were down Micron Technology's fortunes finally may have turned for the better, despite another staggering loss reported Thursday for its latest ... Tradingmarkets Q1 semiconductor revenue at $67.3B Worldwide semiconductor revenue totaled $67.3 billion in the first quarter of 2008, rising five percent year over year, according to a ... MSN Money What the Green Bubble Will Leave Behind All the talk about the bad oil bubble obscures the potentially good bubble still inflating in the realm of alternative energy. Wind ... New York Times Solar-cell spot pricing surges by over 10% in a month Spot pricing for solar cells has surged by over 10% in a month with a premium of almost 20% over contract quotes. The upsurge is due to a ... DigiTimes Tanzania’s $155m ID card contract attracts 104 companies Once again, critics are saying that some of the firms are associated with senior government officials, hence ruling out the possibility ... The East African MEMC Electronic Materials: Climbing the Wall of Worry With the explosion of oil prices and implosion in the value of the dollar, a perfect storm is brewing for U.S.-based, export-oriented ... Seeking Alpha 'Fabless' chip revenue rising fastest Semiconductor companies that do not actually manufacture their own chip designs had stronger revenue growth in the first quarter of this year ... Portland Business Journal Micron Reports $236 Million Loss For Q3 Micron Technology, Inc. has posted a net loss of $236 million, or $0.30 per diluted share, on net sales of $1.5 billion for the third quarter ... EFYTimes Teradyne: Strong Results and Flash Memory Acquisition Continuing my coverage of the ATE industry, in this post, I will discuss Teradyne, the leading supplier of Automatic Test Equipment. Teradyne ... Seeking Alpha Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Technology News   Computer Researchers Look Past Silicon The crystal ball is cloudy when it comes to the nature of future chips. Scientists are racing against the clock to develop a means of ... RedOrbit Researchers demo excitonic transistor Expensive optical-to-electronic-to-optical converters are needed to switch photonic signals. Now, researchers have demonstrated an ... EETimes India Exposing The Sensitivity Of Extreme Ultraviolet Photoresists This finding, announced at a workshop last month,* has attracted considerable interest because of its implications for future ... Science Daily Nanotubes could boost semiconductor production Two Stanford University engineers have developed a nanotechnology that could be used to mass-produce semiconductors that are much faster ... San Francisco Chronicle New process creates 3-D nanostructures with magnetic materials Materials scientists at the National Institute of Standards and Technology (NIST) have developed a process to build complex, three- ... Science Centric Your Laptop's Dirty Little Secret Coal, steel, oil — we think of these old-economy industries, and we picture pollution. Smoggy skies, fouled rivers, toxic waste. As we ... Time Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Corporate News Submit Led Ray Data Now Available Online From OSRAM OPTO Semiconductors OSRAM Opto Semiconductors is the first LED manufacturer in the world to provide direct web access to the ray data files for its light emitting ... OSRAM OPTO Semiconductors SVTC Technologies Selects Processing Tools from SUSS MicroTec SUSS MicroTec, Inc. announces a suite of processing tools that enable new generations of micro-electromechanical systems (MEMS) has been ... SUSS MicroTec, Inc. Henkel’s Dicing Die Attach Films Offer Exceptional Performance and Manufacturability Designed to streamline the die attach for stacked die applications, Hysol® QMI5100 and Hysol QMI5200 combine the properties and functions ... Henkel Today's Sponsor Heraeus - Celebrating 40 years of USA Manufacturing Excellence Heraeus has been developing, manufacturing and supporting Packaging Materials in Pennsylvania for the last 40 years. While competitors are mainly focusing off shore, Heraeus is committed to serving all markets. Learn more about Heraeus materials… Heraeus, Inc. Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Run Cooler with Thermal Interface Materials from Shin Etsu Thermal grease, gel, pads and more for CPU, GPU, PLC and other temperature sensitive components. Excellent ability to dissipate heat; stable under difficult stress testing conditions; enables more functionality. Market proven, high volume, POR — Shin Etsu thermal interface materials. Learn more… ShinEtsu Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.